Strength of Silicon Nitride after Thermal Shock

Jihong She,Jianfeng Yang,Daniel Doni Jayaseelan,Shunkichi Ueno,Naoki Kondo,Tatsuki Ohji,Shuzo Kanzaki
DOI: https://doi.org/10.1111/j.1151-2916.2003.tb03527.x
IF: 4.186
2003-01-01
Journal of the American Ceramic Society
Abstract:A water‐quenching technique was used to evaluate the thermal‐shock strength behavior of silicon nitride (Si 3 N 4 ) ceramics in an air atmosphere. When the tensile surface was shielded from air during the heating and soaking process, the quenched specimens showed a gradual decrease in strength at temperatures above 600°C. However, the specimens with the air‐exposed surface exhibited a ∼16% and ∼29% increase in strength after quenching from 800° and 1000°C, respectively. This is because of the occurrence of surface oxidation, which may cause the healing of surface cracks and the generation of surface compressive stresses. As a result, some preoxidation of Si 3 N 4 components before exposure to a thermal‐shock environment is recommended in practical applications.
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