Abstract:The continuous and aggressive downscaling of conventional CMOS devices has been driving the vast growth of ICs over the last few decades. As the CMOS downscaling approaches the fundamental limits, novel device architectures such as metallic source/drain Schottky barrier MOSFET (SB-MOSFET) and SB-FinFET are probably needed to further push the ultimate downscaling. The ultimate goal of this thesis is to integrate metallic Ni1-xPtx silicide (x=0~1) source/drain into SB-MOSFET and SB-FinFET, with an emphasis on both material and processing issues related to the integration of Ni1-xPtx silicides towards competitive devices. First, the effects of both carbon (C) and nitrogen (N) on the formation and on the Schottky barrier height (SBH) of NiSi are studied. The presence of both C and N is found to improve the poor thermal stability of NiSi significantly. The present work also explores dopant segregation (DS) using B and As for the NiSi/Si contact system. The effects of C and N implantation into the Si substrate prior to the NiSi formation are examined, and it is found that the presence of C yields positive effects in helping reduce the effective SBH to 0.1-0.2 eV for both conduction polarities. In order to unveil the mechanism of SBH tuning by DS, the variation of specific contact resistivity between silicide and Si substrates by DS is monitored. The formation of a thin interfacial dipole layer at silicide/Si interface is confirmed to be the reason of SBH modification. Second, a systematic experimental study is performed for Ni1-xPtx silicide (x=0~1) films aiming at the integration into SB-MOSFET. A distinct behavior is found for the formation of Ni silicide films. Epitaxially aligned NiSi2-y films readily grow and exhibit extraordinary morphological stability up to 800 oC when the thickness of deposited Ni (tNi) <4 nm. Polycrystalline NiSi films form and tend to agglomerate at lower temperatures for thinner films for tNi≥4 nm. Such a distinct annealing behavior is absent for the formation of Pt silicide films with all thicknesses of deposited Pt. The addition of Pt into Ni supports the above observations. Surface energy is discussed as the cause responsible for the distinct behavior in phase formation and morphological stability. Finally, three different Ni-SALICIDE schemes towards a controllable NiSi-based metallic source/drain process without severe lateral encroachment of NiSi are carried out. All of them are found to be effective in controlling the lateral encroachment. Combined with DS technology, both n- and p-types of NiSi source/drain SB-MOSFETs with excellent performance are fabricated successfully. By using the reproducible sidewall transfer lithography (STL) technology developed at KTH, PtSi source/drain SB-FinFET is also realized in this thesis. With As DS, the characteristics of PtSi source/drain SB-FinFET are transformed from p-type to n-type. This thesis work places Ni1-xPtx (x=0~1) silicides SB-MOSFETs as a competitive candidate for future CMOS technology.

Formation of Pre-Silicide Layers below Ni1−xPtxSi/Si Interfaces

Silicide Formation for Ni and Pd Bilayers on Si(100) Substrates

Formation of Nickel-Platinum Silicides on a Silicon Substrate: Structure, Phase Stability, and Diffusion from Ab initio Computations

Kinetics and Morphology of Ni1-xPtx-silicide Epitaxy on Si(001)

Thermal stability, phase and interface uniformity of Ni-silicide formed by Ni–Si solid-state reaction

Understanding Solid-State Interactions: Ultrathin Ni1-xPtx Silicide Films Formed on Si(100)

Morphological Stability and Specific Resistivity of Sub-10 Nm Silicide Films of Ni1−xPtx on Si Substrate

Silicide Formation by Furnace Annealing of Thin Si Films on Large-Grained Ni Substrates

Surface-energy Triggered Phase Formation and Epitaxy in Nanometer-Thick Ni1−xPtx Silicide Films

The Effect of Pd Addition on Silicide Formation for Ni/Pd Bilayers on Silicon

Exploitation of a Self-Limiting Process for Reproducible Formation of Ultrathin Ni1−xPtx Silicide Films

Pt interlayer effects on Ni germanosilicide formation and contact properties

Solid Phase Reaction of Ni/Pd/Si(100) and Enhancement of NiSi Thermal Stability Study

In-situ nanoscale characterization of composition and structure during formation of ultrathin nickel silicide

Ni Silicide and Ni Germanosilicide Self-Aligned Process for 65nm and Beyond CMOS Technology by 2-Step Rapid Thermal Annealing

Effect of Ion Irradiation on the Formation of Ni, Cr and Pt Silicide

Atomic-scale silicidation of low resistivity Ni-Si system through in-situ TEM investigation

Effect of Palladium Addition on Nickel Silicide Formation on Si (111)

Linear Growth of Ni2si Thin Film on N+/P Junction at Low Temperature

A comparative study of C, N and Xe pre-amorphization implantation processes for improving the thermal stability of NiSi films

Direct Transition from Ultrathin Orthorhombic Dinickel Silicides to Epitaxial Nickel Disilicide Revealed by In Situ Synthesis and Analysis