Abstract:Electroplated copper thin films are indispensable for the interconnections in the advanced electronic products, such as TSV (trough silicon via) structures, fine bumps, and thin-film interconnections in various devices and interposers. However, it has been reported that both electrical and mechanical properties of the films vary drastically comparing with those of conventional bulk copper. The main reason for the variation can be attributed to the fluctuation of the crystallinity of grains and grain boundaries in the films. Porous or sparse grain boundaries cause the increase in electrical resistivity and the embrittlement of the films. Thus, the thermal conductivity of the electroplated copper thin films should be varied drastically depending on their micro texture based on Wiedemann-Franz law. Since copper interconnections are used for not only electrical conductor but also thermal heat conductor, it is important to clarify the relationship between the crystallinity and thermal properties of the films. In this study, the local distributions of the crystallinity and physical properties were investigated experimentally. As the result of the temperature distribution due to local Joule heating along an interconnection, it was suggested that the variation in the quality of the grain boundaries in the electroplated copper thin-films caused the non-uniformity of the resistivity and thus, Joule heating in the thin films. In this study, the effect of the seed layer material on the thermal properties of the electroplated copper thin film was investigated. When a Ru seed layer was deposited as a buffer layer between the electroplated copper thin film and the Ta diffusion barrier layer, both the crystallinity and uniformity of grain boundaries in the electroplated copper films were improved since lattice mismatch between copper and the seed layer metal was decreased. The improvement of the crystallinity increased the long-term reliability of the interconnections under the loads of electromigration and stress-induced migration.

Investigation of Grain Growth and Impurity Diffusion in Highly Conductive Copper Interconnect Films Obtained by Pulsed Laser Scanning Annealing

Effect of Thermal Annealing on the Electrical Conductivity of Copper-Tin Polymer Composites.

The Evolution of Microstructure and Resistance in Electroplated Copper Films by Linear Integrated Laser Scanning Annealing

Annealing Effect of High-Density Pulsed Electric Current Treatment on Cold-Rolled 6061 Aluminum Alloy

Effect of in-line electron beam treatment on the electrical performance of Cu/organic low-k damascene interconnects

Anisotropic material properties of pure copper with fine-grained microstructure fabricated by laser powder bed fusion process

Research on Effect of Annealing on Copper Deposited by Electroplating in High Density TSV

Electroless Deposition of Confined Copper Layers Based on Selective Activation by Pulsed Laser Irradiation

Analysis of Energy Density and Scanning Speed Impacts on Ni/Sic Ohmic Contacts During Laser Annealing

Improvement of Wear Resistance in Laser Shock-Peened Copper Contacts

Tailoring surface properties and corrosion resistance of laser shock peened Ti6Al4V alloy by low-temperature annealing

Copper Large-scale Grain Growth by UV Nanosecond Pulsed Laser Annealing

The Portevin-Le Chatelier (PLC) effect in an Al-Cu aluminum alloy fabricated by selective laser melting

Impurity effect on recrystallization and grain growth in severe plastically deformed copper

Enhanced electrical and mechanical properties of additively manufactured pure copper with green laser

Effect of Annealing Process on the Properties of Through-Silicon-via Electroplating Copper

The Investigations of Laser‐Enhanced Copper Plating on a Good Heat Conducting Copper Foil

Effects of preannealing on the diffusion barrier properties for ultrathin W–Si–N thin film

Effect of impurities on anisotropic grain growth in (111)-oriented nanotwinned copper

Improvement of Thermal Conductivity of Electroplated Copper Interconnections by Controlling Their Crystallinity

Investigation of the Behaviors of Various Electroplated Copper Films During CMP