Reduction of Junction Leakage Current in Sub-10 Nm Ultra-Shallow NiGe/n-Ge Schottky Junctions by Dopant Segregation

Rui Zhang,Yi Wang,Junkang Li,Feng Chen,Yi Zhao
DOI: https://doi.org/10.1109/icsict.2016.7998902
2016-01-01
Abstract:The ultra-shallow NiGe/p+-Ge/n-Ge Schottky junctions with dopant segregation have been fabricated using Indium spin-on dopant and thermal diffusion, followed by NiGe growth with microwave annealing technique. The total junction depth of the NiGe/p+-Ge/n-Ge Schottky junction was scaled down to 9 nm, containing 6-nm-thick NiGe and 3-nm-thick p+-Ge region. It is found that the junction leakage current is sufficiently suppressed with the dopant segregation process compared with that of direct NiGe/n-Ge Schottky junction, which is attributed to the increase of effective SBH for electrons in the NiGe/p+-Ge/n-Ge junction.
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