Abstract:Adhesive interactions between soft materials are prevalent in both biological systems and various engineering applications, including soft robots, flexible electronics, and antifouling coatings. Many studies have demonstrated that cavitation and fingering instabilities emerge at the adhesive interface between rigid objects and soft films, owing to the geometric attributes of the contact region. However, in the context of peeling configurations, defining the geometric features is challenging, resulting in relatively scant exploration of interfacial instabilities. Hence, the modulation of instability patterns during the peeling process of a flexible plate from a thin elastic film, alongside the consequential effects on mechanical responses, remains poorly understood. To elucidate the mechanisms underlying interfacial instability during peeling process and its impacts on peel-off force, we use finite element methods to simulate the evolution of interface separation. Consistent with previous experimental observations, we find that the interfacial instability will occur when the bending stiffness of the flexible plate is bigger than a critical value. We show that the interfacial instability is mainly induced by the competition between the adhesion energy and the strain energy of the film, and the incompressibility of the thin film is critical for the appearance of the interfacial instability. Combining theory and finite element simulation, we propose the scaling laws for the critical peel-off force for stable and unstable peelings, respectively, and show that the critical peel-off force will decrease when the interfacial instability occurs. Finally, we demonstrate that weakening the tangential adhesion strength and loosening the constraints between the film and the rigid substrate effectively suppress fingering instability. Collectively, our findings elucidate the pivotal factors influencing interfacial instability, offering invaluable insights for the design of structures or systems involving soft materials.

V-shaped Double Peeling of Films from Curved Rigid Substrates

90-degree peeling of elastic thin films from elastic soft substrates: Theoretical solutions and experimental verification

Peeling Behavior of a Film on Inner Surface of a Tube

Multi-peeling states of elastic film from flexible substrate

Rate-dependent Peeling Behavior of the Viscoelastic Film-Substrate System

Steered Molecular Dynamics Simulation of the Detaching Process of Two Parallel Surfaces Glued Together by a Single Polyethylene Chain

A Steered Molecular Dynamcs Study of Adsorbed Polymer Chains

Exploiting Interfacial Instability During Peeling a Flexible Plate from Elastic Films

Non-linear double-peeling: experimental vs. theoretical predictions

Multiple kinds of peeling processes and instabilities in heterogeneous film peeling

A linear cohesive model of zero degree peeling of a viscoelastic tape from a substrate

Angle-independent optimal adhesion in plane peeling of thin elastic films at large surface roughnesses

Thermally Assisted Peeling of an Elastic Strip in Adhesion with a Substrate Via Molecular Bonds

The Peeling Behavior of Compliant Cylindrical Shells in Adhesive Contact with a Planar Rigid Substrate.

Peeling Mechanics of Film-Substrate System with Mutually Embedded Nanostructures in the Interface

Competing Behavior of Interface Delamination and Wafer Cracking During Peeling Film from Ultra-Thin Wafer

Peeling an elastic film from a soft viscoelastic adhesive: experiments and scaling laws

A General Solution to the Maximum Detachment Force in Thin Film Peeling

The Peeling Behavior of Film/substrate Systems with Periodic and Discontinuous Bonding

The Extended Peel Zone Model: Effect of Peeling Velocity

Viscoelastic peeling of thin tapes with frictional sliding