Angle-independent optimal adhesion in plane peeling of thin elastic films at large surface roughnesses

Weilin Deng,Haneesh Kesari
DOI: https://doi.org/10.1016/j.jmps.2020.104270
2020-04-16
Abstract:Adhesive peeling of a thin elastic film from a substrate is a classic problem in mechanics. However, many of the investigations on this topic to date have focused on peeling from substrates with flat surfaces. In this paper, we study the problem of peeling an elastic thin film from a rigid substrate that has periodic surface undulations. We allow for contact between the detached part of the film with the substrate. We give analytical results for computing the equilibrium force given the true peeling angle, which is the angle at which the detached part of the film leaves the substrate. When there is no contact we present explicit results for computing the true peeling angle from the substrate's profile and for determining an equilibrium state's stability solely from the substrate's surface curvature. The general results that we derive for the case involving contact allow us to explore the regime of peeling at large surface roughnesses. Our analysis of this regime reveals that the peel-off force can be made to become independent of the peeling direction by roughening the surface. This result is in stark contrast to results from peeling on flat surfaces, where the peel-off force strongly depends on the peeling direction. Our analysis also reveals that in the large roughness regime the peel-off force achieves its theoretical upper bound, irrespective of the other particulars of the substrate's surface profile.
Applied Physics,Soft Condensed Matter
What problem does this paper attempt to address?
The problem that this paper attempts to solve is how the peeling force between an elastic film and a substrate changes with the peeling angle on a periodically corrugated surface with large surface roughness. Specifically, the authors studied the mechanical behavior when peeling a thin elastic film from a rigid substrate with periodic surface undulations. They focused on whether the peeling force would become independent of the peeling direction when the roughness of the substrate surface is large, and whether this peeling force can reach the theoretical maximum regardless of the specific contour of the substrate surface. ### Main findings of the paper: 1. **Direction independence of the peeling force**: When the roughness of the substrate surface is large, the peeling force can become independent of the peeling direction. This is achieved by increasing the surface roughness, which is in sharp contrast to the situation of peeling on a flat surface, where the peeling force strongly depends on the peeling direction. 2. **Maximum value of the peeling force**: In the high - roughness region, the peeling force not only becomes independent of the peeling direction, but also its magnitude actually reaches the theoretical maximum that can be reached during the process of peeling a thin elastic film from a rigid substrate, regardless of the specific contour of the substrate surface. ### Methodology: - **Assumptions**: The paper assumes that in the initial state, the film is completely attached to the substrate without gaps. In the attached area, no sliding is allowed between the film and the substrate surface. The JKR theory is used to model the adhesion interaction between the film and the substrate, that is, the energy of the system increases linearly during the peeling process, and the increase is proportional to the area of the detached region of the film - substrate interface. - **Analysis**: The authors derived the analytical results for calculating the equilibrium force at a given real peeling angle and presented a method for calculating the real peeling angle in the absence of contact. In addition, an algorithm is provided for numerically calculating the real peeling angle of the configuration and determining the stability of the equilibrium state. ### Conclusions: The research results of the paper show that on a periodically corrugated surface with large surface roughness, through appropriate design of the surface structure, the direction independence of the peeling force can be achieved, and the peeling force can reach the theoretical maximum. This finding is of great significance for the development of new materials with specific adhesion characteristics, especially in micro - manufacturing and 3D printing technologies. ### Formula summary: - **Calculation of peeling length**: \[ l(a; \rho)=\int_{0}^{a} d x_{1}\left(1+\dot{\rho}\left(x_{1}\right)^{2}\right)^{1 / 2} \] - **Change in potential energy**: - Change in adhesion energy: \[ w \delta l \] - Change in elastic energy: \[ \frac{1}{2} F^{2} \delta l \] - Change in potential energy of the device maintaining a constant force: \[ -F \cdot \delta u \] These results provide an important theoretical basis for understanding the influence of surface roughness on the film peeling behavior.