Design and Evaluation of a SiC and Si IGBT Hybrid Three-Level ANPC Power Module

Chao Wang,Jupeng Pang,Kui Wang,Xiangwei Zhang,Zedong Zheng,Yongdong Li
DOI: https://doi.org/10.1109/syps59767.2023.10268235
2023-01-01
Abstract:Three-level (3L) inverters have more power switches in a single current commutation loop (CCL) compared with the two-level (2L) ones, which results in larger parasitic inductance. Integrating the 3L topologies into power modules can reduce parasitic inductance to a certain extent. This paper designs a SiC and Si IGBT three-level hybrid ANPC power module. It combines the advantages of the switching characteristics of SiC MOSFETs and the on-state characteristics of Si IGBT, which presents similar operating characteristics but lower costs compared with the full-SiC module. The layout of the designed module is introduced and the parasitic inductances of the module are analyzed to establish the circuit model of the module. Meanwhile, thermal simulations have been done to evaluate the thermal performance of the module. A module using 750V/15mΩ SiC MOSFET and 650V/75A Si IGBT is fabricated to verify the design and simulation. The double pulse test of the module is designed and conducted to evaluate the characteristics of the fabricated module.
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