New Insight into the Size-Controlled Synthesis of Silver Nanoparticles and Its Superiority in Room Temperature Sintering

Yanjun Tang,Wei He,Shouxu Wang,Zhihua Tao,Lijuan Cheng

DOI: https://doi.org/10.1039/c3ce42439a

IF: 3.756

2014-01-01

CrystEngComm

Abstract:Silver nanoparticles with a controlled size present a high conductivity after room temperature sintering achieved by a chemical process.

What problem does this paper attempt to address?

New insight into Size-Controlled Synthesis of Silver Nanoparticles and Its Superiority in Room Temperature Sintering

Wei He

DOI: https://doi.org/10.1039/c3ce42439a

IF: 3.756

2014-01-01

CrystEngComm

Abstract:Please note that technical editing may introduce minor changes to the text and/or graphics, which may alter content. The journal’s standard Terms & Conditions and the Ethical guidelines still apply. In no event shall the Royal Society of Chemistry be held responsible for any errors or omissions in this Accepted Manuscript or any consequences arising from the use of any information it contains. Accepted Manuscript
Synthesis and Low-Temperature Sintering of Tin-Doped Silver Nanoparticles

Yujun Zhang,Hui Yu,Liangliang Li

DOI: https://doi.org/10.1109/isapm.2011.6105702

2011-01-01

Abstract:Ag nanoparticles have been widely used in electronic packaging due to their low-temperature sintering properties. It is important to lower the melting point of Ag nanoparticles to achieve a better electrical/thermal conduction and mechanical strength. In this paper, a large amount of Sn-doped Ag nanoparticles with a size less than 10 nm were synthesized and the EDS and XRD data showed that the Sn atoms entered the Ag lattice. The sintering properties of the nanoparticles baked at different temperatures was investigated by SEM and a larger coalescence was observed for the Sn-doped Ag nanoparticles compared to the pure Ag nanoparticles, indicating that Sn helped the sintering of the nanoparticles. TGA and DSC experiments were also carried out to study the sintering process in detail.
Shape-Controlled Synthesis and Applications of Silver Nano-Particles

Zhang Taiwei,Zhang Lu,Yang Shengchun,Yang Zhiniao,Ding Bingjun

DOI: https://doi.org/10.3321/j.issn:1002-185x.2007.08.043

2007-01-01

Abstract:Nano-sized metal particles exhibit the unique thermal, optical, electric, magnetic and catalyzing properties comparing with those of bulk ones due to the small-size effect, surface effect and quantum size effect. The properties of metal nanoparticles are strongly dependent on their size and shape. In recent years, the shape-controlled synthesis of nano-particles has been attracting more and more attentions. The synthesis methods of controlling the size and shape of metal nano-particles (in the case of silver) are introduced in this review.
Parametric study on conductive patterns by low-temperature sintering of micron silver ink

Man Zhao,Gongwen Tang,Shuai Yang,Shancan Fu

DOI: https://doi.org/10.1039/d2ra07889a

IF: 4.036

2023-01-01

RSC Advances

Abstract:The fabrication of dense conductive patterns was achieved by low-temperature sintering of 1–3 μm micron silver flakes with the help of the addition of a small amount of nanosilver particles.

chemistry, multidisciplinary
Study on Low Temperature Sintering Mechanism and Performance of Multiscale Silver Paste

Yiping Wang,Dongsheng Yang,Peng Wu,Shang Wang,Yilong Huang,Jiayun Feng,Jiayue Wen,Yanhong Tian

DOI: https://doi.org/10.1109/icept59018.2023.10492247

2023-01-01

Abstract:With the vigorous development of new-energy area, the demand for high-power device gradually increases. However, high power inevitably cause a problem of heat accumulation. Materials with high thermal dispersion performance are required. Nano pastes that can be used for low temperature connection and high temperature service. Nowadays, multi-size particles mixed nano pastes have been developed, and mixed pastes based on micron silver as the skeleton exhibit better performance, including smaller porosity and better thermal conductivity. Nano particles plays a similar role like connection bridge between micro particles and flakes. After sintering at 200 degrees C for 2 h, dense joint with basic performance is obtained and sintering at 300 degrees C for 2 h, the thermal conductivity of the solder joint will reach 284 W/(mK).
A Review on Diverse Silver Nanostructures

x k,meng,s c,tang,vongehr,孟祥康

DOI: https://doi.org/10.1016/S1005-0302(10)60078-3

2010-01-01

Abstract:This article reviews recent advances in the utilization of various water based synthesis routes towards the shape-controlled synthesis of silver nanoparticles and microstructures in a diverse range of shapes and sizes from several nanometers to micrometers.A variety of very simple one-pot methods,at times employing commercial microwave ovens,inexpensive low power ultrasound cleaners,or two-electrode electro-chemistry,can be surprisingly effective in the controlled synthesis of a wide range of nanostructured products,if only parameters are carefully chosen.Many approaches which are adopted include synthesis of Ag nanostructures with various shapes in solution,doping of Ag nanoparticles on unmodified silica and on/inside carbon spheres,kinetically controlled growth of Ag micro-particles with novel nanostructures on flat substrates,and galvanic replacement towards bimetallic Ag-Au dendrites and carbon composites.Characterizations of shape,composition and microstructure are carried out via scanning and transmission electron microscopy,various spectroscopy methods,N2 absorption measurements and suchlike.The involved growth mechanisms are investigated in order to discover new means towards better control.Size,location and shape control,including micro-and nanostructure features,allows tuning the products properties towards desired applications.We focus on the optical properties and catalytic activities,but also the stability of compounds can be an issue of interest.
Present status and prospects of nano-silver particles in the electronic field: a review

Jiayi Li,Shuai Zhang,Kyung-Wook Paik,Yew-Hoong Wong,Peng He,Shuye Zhang

DOI: https://doi.org/10.1080/01694243.2024.2408370

IF: 2.431

2024-10-02

Journal of Adhesion Science and Technology

Abstract:Compared with conventional solders, nano-silver benefits low-temperature sintering and high-temperature service, perfectly matching the high-temperature operating environment for third-generation semiconductor devices. However, the synthetic cost, complexity of the sintering process and the low connection strength limit its development. This paper describes the physical, chemical reduction and biological methods of synthesizing and compares the advantages and disadvantages of these three methods. The process parameters affecting the sintering process of silver nanoparticles (Ag NPs) are presented in a comprehensive and in-depth manner. Present methods are also introduced to improve the quality of nano-silver joints, such as the adding enhancement, the silver nanostructured films, and a trimodal-Ag paste consisting of silver particles in three sizes: nano, submicron and micron, aiming to break the limitation of the poor quality of nano-silver joints. In addition, this paper provides the first comprehensive summary of the sintering process and sintering mechanism of nano-silver, and introduces the latest results of the study of the sintering mechanism of nano-silver by using the Molecular Dynamics Simulation (MDS) technique. At the end, the advanced applications of nano-silver are shown, thus pointing out the direction for the further development and applications of nano-silver.

materials science, multidisciplinary,engineering, chemical,mechanics
Low Temperature Sintering of Silver Nanoparticle Paste for Electronic Packaging

Hongqiang Zhang,Guisheng Zou,Lei Liu,Aiping Wu,Y. Norman Zhou

DOI: https://doi.org/10.1109/icep.2016.7486837

2016-01-01

Abstract:Silver nano paste as die attach materials could achieve low temperature joining and high temperature application in the microelectronics industry. Large scale synthesis the silver nanoparticles is still critical issue. This study demonstrated that silver nanoparticles were cost-effectively and environmental-friendly synthesized by arc discharge in liquid. Silver nanoparticles were spherical and well dispersion, and had three distributions and the average sizes are 6 nm, 40 nm and 220 nm, respectively. This mixed size silver nanoparticles and certain content polymer form silver nano paste, which used as die attach materials to sinter the chip and Al2O3 direct bonded copper (DBC) substrate. The results showed that the shear strength of die attachment joint could reach 18 MPa. There were two fracture types of joint during die shear: interfacial and partial interfacial fracture. Increasing the sintering temperature could improving the shear strength of die attachment joint.
Study On The Synthesis Of Silver Nanowires With Adjustable Diameters Through The Polyol Process

Chang Chen,Li Wang,Guohua Jiang,Junfeng Zhou,Xu Chen,Haojie Yu,Qiang Yang

DOI: https://doi.org/10.1088/0957-4484/17/15/054

IF: 3.5

2006-01-01

Nanotechnology

Abstract:Silver nanowires with adjustable diameters ranging from 20 to 500 nm have been synthesized by introducing certain control agents into the conventional polyol process. These control agents can be classified into three types: inorganic anions, metal cations, and molecules. The as-synthesized nanowires also exhibit size dependent UV-vis absorption spectra, which are meaningful to the fabrication of nanodevices. It is presumed that the control agents could influence the size of the initial nucleus and therefore the diameters of the final nanowires through forming silver salt colloids or varying the rate of silver reduction. This synthetical strategy may also provide a versatile route to prepare nanomaterials with well-defined diameters.
Atomic Insights into the Sintering Behaviour of Ag-Cu Solid Solution Nanoparticles on Ag Substrate

Zhicheng Wen,Wei Liu,Chunjin Hang,Rong An,Yanhong Tian

DOI: https://doi.org/10.1016/j.jmrt.2024.11.241

IF: 6.267

2024-11-29

Journal of Materials Research and Technology

Abstract:In electronic packaging industry, it has been reported that compared with nano silver and nano copper, the complementation and coordination of Ag and Cu components enable bimetallic nanomaterials enhanced anti-electromigration and oxidation inhibition characteristics. Ag-Cu solid solution nanoparticles (ACDS NPs) has become an emerging substitution and garnered widespread attention. This research presents the investigation into the size-dependent melting behaviour of ACDS NPs and the effect of elevated temperature during the pressure-free sintering with Ag substrate through molecular dynamics simulations. The melting points of ACDS NPs turn out to be in accordance with Gibbs Thomson equation, based on which the suitable sintering temperatures have been determined within 473 and 773 K. As demonstrated by dynamic trajectories at cross section while sintering, coalescence between NPs occurs with the atomic surface diffusion at the sintering neck along the vacancy concentration gradient. 623 K is estimated to be a threshold temperature of complete integration of NPs at which the crystallographic structure collapses during sintering and recrystallizes at the late sintering stage. The dominant sintering mechanisms transferred from surface diffusion and dislocation-based plastic deformation below 573 K to atomic diffusion above 623 K. Furthermore, the results present incontrovertible dominance of Shockley dislocations and interaction energy on determining mechanical properties of sintered atomistic system. It is also revealed that the systems sintered below 673 K yield significantly lower thermal conductivity attributing to the strong localization of heat carriers for intrinsic amorphous structure than crystalline counterparts above 723 K.

materials science, multidisciplinary,metallurgy & metallurgical engineering
Elucidation of the capillarity-promoted sintering of silver nanoparticles produced by a spark ablation vapor source

Yu Zhang,Junyu He,Jin Tong,Haiqi Lai,Peilin Liang,Zhongwei Huang,Shiwo Ta,Tingyu Lin,Guannan Yang,Chengqiang Cui

DOI: https://doi.org/10.1016/j.apt.2023.103972

IF: 4.969

2023-04-01

Advanced Powder Technology

Abstract:Through the spark ablation method, high purity, spherical silver nanoparticles (Ag NPs) with a size of 5 ± 3 nm are prepared. A solvent-assisted sintering method is developed to modulate the sintering structure and properties of the as-prepared Ag NPs. The effects of the solvents terpineol, polyethylene glycol-200, 1,2-propanediol, and ethylene glycol are explored. The results show that treatment with ethylene glycol causes the shear strength of the sintered Ag NPs at 180, 220, 260, and 300 °C to significantly improve from 0, 3.7, 22.1, and 64.6 MPa to 37.1, 56.1, 76.6, and 93.1 MPa respectively. Additionally, the size and number of voids in the sintered structure are significantly reduced. From the perspective of the capillary pressure induced by the solvent during sintering, a correlation between low solvent wettability and small agglomerate size of the Ag NPs is revealed, which reasonably explains the structure and properties of the sintered Ag NPs that were treated with different solvents. The spark ablation and solvent-assisted sintering methods provide a new approach for the fabrication and structure–property design of metal NPs for electronic applications.

engineering, chemical
Direct pen writing and atomic-scale molecular dynamics simulation study of a novel silver nano-ink

Longchao Zhuo,Qinghao Wang,Jiacheng Sun,Yaoyao Feng,Enhuai Yin,Wen Liu,Bingqing Chen,Samuel Lin,Qiqi Zhang

DOI: https://doi.org/10.1007/s10854-023-11628-8

2023-11-19

Journal of Materials Science Materials in Electronics

Abstract:Herein, a facile synthesis approach for silver nanoparticles is disclosed through reduction action without the need for a peristaltic pump or inert gas shielding has been disclosed. Subsequent electron microscopy, X-ray diffraction, Ultraviolet–Visible spectroscopy and Fourier transform infrared spectroscopy were conducted to characterize the optimized nanoparticles with an average grain size of 29.9 nm. Employing a designed ink containing 35 wt% silver, four types of inks by direct writing showed different printability on the glass surface and conductive behavior. A resistivity value as low as 4.7 × 10 −7 Ω m was achieved following basic traditional sintering process at 250 °C for 30 min, along with stable electrical conductivity under repeated bending, suitable for bending in flexible electronic devices. Finally, molecular dynamics simulation was applied to gain a deeper understanding of the melting and sintering processes of Ag nanoparticles during the atomic-level bonding.

engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied
Deep Crystallization Induced High Thermal Conductivity of Low-Temperature Sintered Ag Nanoparticles

Hongjun Ji,Shuai Wang,Mingyu Li,Jongmyung Kim

DOI: https://doi.org/10.1016/j.matlet.2013.11.030

IF: 3

2013-01-01

Materials Letters

Abstract:We studied the mechanism and morphological evolution of a thermal interface material prepared by pressureless sintering of a paste containing silver nanoparticles (Ag NPs) flocculated with citrate or nitrate. A high thermal conductivity (>100W/K-m) was obtained from the material sintered at 453K for 30min. Significant crystallization and large amounts of twins were observed in the material. These results could be ascribed to the thinner organic shells surrounded the Ag NPs, resulting in easy activation of Ostwald ripening.
Mechanism of Low Temperature Sintering-Bonding Through In-Situ Formation of Silver Nanoparticles Using Silver Oxide Microparticles

Fengwen Mu,Zhenyu Zhao,Guisheng Zou,Hailin Bai,Aiping Wu,Lei Liu,Dongyue Zhang,Y. Norman Zhou

DOI: https://doi.org/10.2320/matertrans.md201231

2013-01-01

MATERIALS TRANSACTIONS

Abstract:In this paper, a low temperature sintering-bonding process through in-situ formation of silver (Ag) nanoparticles using silver oxide (Ag2O) microparticles was studied. The Ag2O powders were mixed with triethylene glycol (TEG) to form a paste, which was used to bond the Ag-coated copper (Cu) bulks. The results revealed that high temperature was helpful to increase the bond strength, and the joints average shear strength can reach 21.9 MPa at 523 K under 2 MPa for 5 min. And the mechanism of the reaction and sintering bonding process were basically made clear by using TGA-FTIR, FE-SEM and XRD, further, a reasonable sintering-bonding model was proposed.
Silver frameworks based on self-sintering silver micro-flakes and its application in low temperature curing conductive pastes

Haijiao Zhan,Jiayu Guo,Xiazhen Yang,Bing Guo,Wei Liu,Hangyan Shen,Xiaorong Wang,Weigang Tang,Fei Chen

DOI: https://doi.org/10.1007/s10854-019-02511-6

2019-11-12

Abstract:There is a growing demand for silver pastes and inks used in the field of printed electronics. The synthesis of organic surfactant stabilized silver micro-flakes by the solution-phase chemical reduction method at room temperature has attracted wide attention due to its simple equipment, convenient operation and affordable price. However, the electrical conductivity of silver micro-flakes-filled conductive pastes and inks are significantly influenced by residual surfactants. Therefore, the surface modification of silver micro-flakes to remove surface adsorbents becomes a key issue. In this study, the silver frameworks based on the self-sintering silver micro-flakes at room temperature are developed for silver pastes with excellent conductivity. The silver paste with 48 wt% of the sodium nitrate and succinic acid treated silver powders has a resistivity of 1.08 × 10<sup>−6</sup> Ω m and excellent adhesion strength after being cured at 140 °C in an oven.

engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied
Large-Scale synthesis of silver nanoparticles by aqueous reduction for low-temperature sintering bonding

Qiu Xiliang,Cao Yang,Lin Tiesong,He Peng,Wang Jun,Liu Ping,Gu Xiaolong

DOI: https://doi.org/10.1155/2014/594873

IF: 3.791

2014-01-01

Journal of Nanomaterials

Abstract:Silver nanoparticles with average diameter of 22.4 nm were prepared by aqueous reduction method for low-temperature sintering bonding application. The reaction temperature and PVP concentration, which are the influential factors of nanoparticle characteristics, were investigated during reduction process. In our research, monodispersity of nanoparticles was remarkably improved while unfavorable agglomeration was avoided with the AgNO3/PVP mass ratio of 1:4 at the reaction temperature 30° C. Besides, copper pads were successfully bonded using sintering paste employing fresh silver nanoparticles with diameter of 20-35 nm at 200°C. In addition, after morphology of the bonding joint was analysed by scanning electron microscope (SEM), the porous sintering characteristics were confirmed.
Facile Synthesis of Silver Nanoparticles and Preparation of Conductive Ink

Gui Bing Hong,Yi Hua Luo,Kai Jen Chuang,Hsiu Yueh Cheng,Kai Chau Chang,Chih Ming,Chih Ming Ma

DOI: https://doi.org/10.3390/nano12010171

IF: 5.3

2022-01-05

Nanomaterials

Abstract:In the scientific industry, sustainable nanotechnology has attracted great attention and has been successful in facilitating solutions to challenges presented in various fields. For the present work, silver nanoparticles (AgNPs) were prepared using a chemical reduction synthesis method. Then, a low-temperature sintering process was deployed to obtain an Ag-conductive ink preparation which could be applied to a flexible substrate. The size and shape of the AgNPs were characterized by ultraviolet–visible spectrophotometry (UV-Vis) and transmission electron microscopy (TEM). The experiments indicated that the size and agglomeration of the AgNPs could be well controlled by varying the reaction time, reaction temperature, and pH value. The rate of nanoparticle generation was the highest when the reaction temperature was 100 °C within the 40 min reaction time, achieving the most satisfactorily dispersed nanoparticles and nanoballs with an average size of 60.25 nm at a pH value of 8. Moreover, the electrical resistivity of the obtained Ag-conductive ink is controllable, under the optimal sintering temperature and time (85 °C for 5 min), leading to an optimal electrical resistivity of 9.9 × 10−6 Ω cm. The results obtained in this study, considering AgNPs and Ag-conductive ink, may also be extended to other metals in future research.

materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology,chemistry
A New Approach Causing the Patterns Fabricated by Silver Nanoparticles to Be Conductive Without Sintering

Yao Tang,Wei He,Guoyun Zhou,Shouxu Wang,Xiaojian Yang,Zhihua Tao,Juncheng Zhou

DOI: https://doi.org/10.1088/0957-4484/23/35/355304

IF: 3.5

2012-01-01

Nanotechnology

Abstract:Silver nanoparticles (Ag NPs) with a mean size of about 90 nm were synthesized by polyol reduction of silver nitrate with ethylene glycol (EG) in the presence of poly(vinyl pyrrolidone) (PVP). The Ag NPs undergo a spontaneous coalescence in the presence of chloride ions even without a traditional sintering process which occurs at a relatively high temperature. Such behavior can cause a rapid decrease in the resistivity of the patterns fabricated by Ag NPs. Conductive silver lines were successfully fabricated on FR-4 substrate using this method. The resulting conductivity of the silver lines reached about 16% of the bulk silver value, which enables fabrication of conductive patterns on some electronic devices.
Scalable Synthesis and Application of Mono-Dispersed Hierarchical Silver Micro-Particles

Rui Yang,Cheng Yang,Yubin Deng,Yingying Luo,Dang Wu,Yang Wang,Xiaoya Cui,Ronghe Wang

DOI: https://doi.org/10.1109/icept.2016.7583267

2016-01-01

Abstract:Hierarchical metals with abundant nanostructures are expected to provide excellent performance characteristics in electronic printing or packaging, catalysis, molecular detection, sensing, and microfluidic flow control, due to the inherent fascinating properties of metal framework (e.g. superior electrical conductivity, catalytic activities, optical properties, etc.) and the general characteristics of hierarchical materials. Yet it is still great challenging to synthesize hierarchical metals with controllable morphologies and nanostructures in large-scale via a facile synthetic method. Here we demonstrate a one-step method to fabricate mono-dispersed hierarchical silver micro-particles with tailored size and morphology in high yields. The silver micro-particles can be obtained merely by mixing the silver salts, reducing agents and surfactants simultaneously. Controllable morphologies and nanostructures can be realized simply by adjusting the reaction parameters, such as the concentration of reactants, mixing velocity, reaction temperature, and so forth. These silver micro-particles possess unique hierarchical structures with abundant nano-sized structures and uniformly distributed mesopores, which provide excellent low-temperature sintering ability and strong electromagnetic field enhancement effect. The facile and efficient synthetic method, along with such intriguing characteristics, renders the silver micro-particles with considerable interest in a wide variety of applications in future electronic devices.
Molecular dynamics simulation study of sintering mechan-ism and thermal conductivity of nano-Ag particles

WU Peng,WANG Yiping,YANG Dongsheng,FENG Jiayun,TIAN Yanhong

DOI: https://doi.org/10.12073/j.hjxb.20230613002

2023-01-01

Abstract:Nanosilver paste can achieve low-temperature sin-tering and high-temperature service,due to its special size ef-fect and high specific surface area,which has a broad applica-tion prospect in the third-generation semiconductor packaging.However,the sintering mechanism of nanoparticles has not been clear and the thermal conductivity has decreased signific-antly after sintering,which needs to be further investigated.In this paper,the sintering process of silver nanoparticles was simulated by molecular dynamics simulation.The correctness of the potential function was verified by the calculation of thermal conductivity,firstly.And then the microstructural changes of silver nanoparticles were observed,the relationship between the sintering neck growth length and the sintering time was obtained,and the change of the phonon thermal conductiv-ity at the sintering neck was also calculated.Finally,the exper-imental silver nanoparticles with the same characteristics as the simulation results were observed by the transmission electron microscope.The results showed that the fivefold twins were the stable structure of nanoparticles after sintering,the sinter-ing neck length growth during nanoparticle sintering was a power function of time,and the microstructure at the sintering neck reduced the thermal conductivity of nanosilver by 4.42%.

New Insight into the Size-Controlled Synthesis of Silver Nanoparticles and Its Superiority in Room Temperature Sintering

New insight into Size-Controlled Synthesis of Silver Nanoparticles and Its Superiority in Room Temperature Sintering

Synthesis and Low-Temperature Sintering of Tin-Doped Silver Nanoparticles

Shape-Controlled Synthesis and Applications of Silver Nano-Particles

Parametric study on conductive patterns by low-temperature sintering of micron silver ink

Study on Low Temperature Sintering Mechanism and Performance of Multiscale Silver Paste

A Review on Diverse Silver Nanostructures

Present status and prospects of nano-silver particles in the electronic field: a review

Low Temperature Sintering of Silver Nanoparticle Paste for Electronic Packaging

Study On The Synthesis Of Silver Nanowires With Adjustable Diameters Through The Polyol Process

Atomic Insights into the Sintering Behaviour of Ag-Cu Solid Solution Nanoparticles on Ag Substrate

Elucidation of the capillarity-promoted sintering of silver nanoparticles produced by a spark ablation vapor source

Direct pen writing and atomic-scale molecular dynamics simulation study of a novel silver nano-ink

Deep Crystallization Induced High Thermal Conductivity of Low-Temperature Sintered Ag Nanoparticles

Mechanism of Low Temperature Sintering-Bonding Through In-Situ Formation of Silver Nanoparticles Using Silver Oxide Microparticles

Silver frameworks based on self-sintering silver micro-flakes and its application in low temperature curing conductive pastes

Large-Scale synthesis of silver nanoparticles by aqueous reduction for low-temperature sintering bonding

Facile Synthesis of Silver Nanoparticles and Preparation of Conductive Ink

A New Approach Causing the Patterns Fabricated by Silver Nanoparticles to Be Conductive Without Sintering

Scalable Synthesis and Application of Mono-Dispersed Hierarchical Silver Micro-Particles

Molecular dynamics simulation study of sintering mechan-ism and thermal conductivity of nano-Ag particles