Characterization of Reliabilities of 22 Nm UTBB FDSOI Ring Oscillators

Chang Cai,Kai Zhao,Jian Yu,Gengsheng Chen,Mingjie Shen,Bingxu Ning,Jun Yu
DOI: https://doi.org/10.1109/icsict55466.2022.9963255
2022-01-01
Abstract:In this paper, the Ring Oscillators (ROs) with inverters, 8 (or 16) dividers, and 3-level buffers are fabricated in a 22 nm Ultra-Thin Body and Buried oxide (UTBB) Fully Depleted Silicon on Insulator (FDSOI) technology. The ROs are comprehensively characterized by reliability tests including the impact of core voltages, temperatures, body bias, and Total Ionizing Dose (TID) effect. The RO frequency shows positive correlation with the increase of core voltage. With the positive variation of temperature conditions, the exponential growth of standby current, linear increase of the working current, and oscillation frequency are investigated in HSPICE simulation and measured by Automatic Test Equipment (ATE). Besides, the phenomenon of leakages for the core current and the Input/ Output (I/O) current are observed owing to the TID effect. Though the TID-induced degradations in frequency are observed, the ROs still have regular working functions.
What problem does this paper attempt to address?