A SISL Coupler Using Two Layers of Coupled Line Structure with Dense Interconnecting Vias

Yu Yi,Guangfei Qi,Xianfang Zhang,Yongliang Zhang,Linping Feng,Haiwen Liu,Chen Yang
DOI: https://doi.org/10.1109/aces-china56081.2022.10065255
2022-01-01
Abstract:In this paper, A substrate integrated suspended Line(SISL) coupler using two layers of coupled line structure with dense interconnecting vias has been proposed. SISL technology can realize low loss, light weight, and self-packaging. Two layers of coupled line structure with dense interconnecting vias can achieve coupling enhancement for the coupler. This coupler has been designed, fabricated, and measured at 3.05GHz.
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