Design of Substrate Integrated Coaxial Line under Silicon-based MEMS Process

Keyu Dong,Xiaochun Li,Ken Ning,Yan Shao,Junfa Mao
DOI: https://doi.org/10.1109/ieee-iws.2019.8803877
2019-01-01
Abstract:Substrate integrated coaxial line (SICL) has wideband and low loss features due to its quasi-closed structure. In this paper, a 50 Ω SICL-based interconnect with its quasi-coaxial transition is designed and fabricated under silicon-based MEMS process. Due to impedance discontinuity between the SICL and its transition, step impedance matching circuit is introduced for low reflection loss. The measurement results show that 3 dB bandwidth of the SICL interconnect is 77 GHz. Compared with those under other processes, the SICL fabricated under MEMS process has wider bandwidth and lower loss and hence it can be applied in high-speed system in packages (SIPs) and integrated circuits (ICs).
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