A Low loss feed line for patch antenna based on silicon in millimeter-wave applications

Shengjuan Zhou,Huang Chen,Xuesong Zhang,Qian Wang,Jian Cai

DOI: https://doi.org/10.1109/ICEPT50128.2020.9202933

2020-01-01

Abstract:Silicon substrate plays an important role in 3D package integration due to the precise wiring process and low CTE of materials. However, the high loss of silicon limits its application in millimeter-wave field. In this paper, a low loss feed line comprised of CPW(coplanar waveguide) with shield line and S-COV(silicon-core coaxial via) is proposed and applied to stimulate a millimeter-wave patch antenna. The proposed feed line process is also presented, which is simple, compatible with conventional semiconductor processes and time-saving compared with a traditional TSV. Simulation results show that the feed line has similar electrical characteristics as the ordinary feed solution based on organic substrate, even though this path is through common low resistance silicon substrate. In well-matched condition, the measured insertion loss of the feed line is -0.3 dB at 80 GHz. The antenna fed by this structure has small performance reduction, revealing its feasibility in vertical antenna feed or even 3D integration in millimeter-wave applications.