A High Coupling Interdigital Coupler Based on Substrate Integrated Coaxial Line

Liang Zhou,Feng Xu
DOI: https://doi.org/10.1109/apcap50217.2020.9246160
2020-01-01
Abstract:In this paper, a high coupling interdigital coupler based on substrate integrated coaxial line (SICL) technology is proposed. The design of coupler is based on SICL technology, so it has many advantages, such as shielding structure to keep it away from lateral leakage, crosstalk or unwanted parallel board mode, light weight, low cost, easy to integrate with planar circuit. The high coupling degree of the coupler is achieved by adopting interdigital coupling line structure. Through modeling and simulation in HFSS, it can be seen that in the frequency band of 2.8-3.2GHz, S21 and S31 are -3.1±0.9dB, return loss is better than -15dB, isolation is better than -16dB. Inaddition, a phase difference of 90 ± 3° is generated between the through end and the coupling end.
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