Study on SiC particles-assisted through-mask electrochemical machining of microporous array structure on metal

DU Liqun,ZHENG Kunming,YU Mingxin,CHENG Haohao,WANG Shuxuan
DOI: https://doi.org/10.19289/j.1004-227x.2023.07.008
2023-01-01
Abstract:Aiming at the problems existing in through-mask electrochemical machining(TMECM) of microporous array structure i.e. poor localization and inaccurate diameter and insufficient depth of micropores, it was proposed to carry out TMECM with the assistance of SiC particles(the process was noted as PA-TMECM). The effects of diameter and mass fraction of SiC particles and flow rate of electrolyte on the fabrication of microporous array structure were studied, and the mechanism of PA-TMECM was discussed. The experimental results showed that it had the best machining localization with an etching factor of 3.52 for PA-TMECM with 6 g/L of SiC particles(40 μm in diameter) at an electrolyte flow rate of 3 000 mL/min. The electrolytic products on the surface of anode can be removed efficiently due to the continuous and highly frequent impact of the particles onto the anode surface during PA-TMECM, not only increasing the etching depth of micropores, but also limiting the lateral corrosion of micropores, finally improving the machinning localization.
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