Abstract:Electrical contact materials with excellent performances are crucial for the development and safe use of electrical contacts in different applications. In our work, reduced graphene oxide (rGO)/copper (Cu) composite films, as potential electrical contact materials, have been synthesized on copper foil with one-step electrochemical reduction deposition method. Cyclic voltammetry (CV) was used to define the deposition conditions, and confocal Raman microscopy (CRM), X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM) were used to characterize the chemical compositions, molecular and micro- and nano-structures of the composite films. Atomic force microscopy/scanning Kelvin probe force microscopy (AFM/SKPFM), conductive AFM (C-AFM) as well as impedance analysis were employed to evaluate the electroactive/electrical properties of the prepared composite films, respectively. The CRM and XPS results suggest that the rGO/Cu composite films can be synthesized through one-step electrochemical codeposition using suitable precursor solutions. Within a short deposition period, the growth of discrete nanograins in the composite film predominates, whereas pine-tree-leaf nanostructures are formed in the composite film when the deposition period is long, due to the chelating role of GO or rGO to regulate the growth rate of metallic copper nanograins. The electrical resistivity of the composite films is lower than the polished Cu foil and the electrodeposited Cu film, probably due to the higher conductivity (enhanced transfer of charge carriers) of the rGO incorporated in the composite films. The Volta potential variation in the rGO/Cu composite film is quite different from that in the electrodeposited Cu film. The electroactivity of the rGO/Cu composite films is higher than the electrodeposited Cu film, but lower than polished Cu foil, and the underlying mechanisms have been discussed.

Electrochemically Reduced Graphene Oxide (Ergo)-Cu Bilayer Structure Fabricated at Room Temperature for Future Interconnects

Effect of Reduction Degree of Graphene Oxide on Electrical Property of ERGO-Cu Bishell Interconnect Structure

Modeling and Characterization of Cu-Graphene Heterogeneous Interconnects

High‐frequency Modeling of Cu‐graphene Heterogeneous Interconnects

Electrothermal Characterization of Multilevel Cu-Graphene Heterogeneous Interconnects in the Presence of an Electrostatic Discharge (ESD)

Remarkable Effects of an Electrodeposited Copper Skin on the Strength and the Electrical and Thermal Conductivities of Reduced Graphene Oxide-Printed Scaffolds

An Investigation of Electric Resistance of Graphene-Coated Copper Thin Film from First Principles

Suppression of copper surface oxidation by electrophoretically deposited graphene oxide film

Intercalated Multilayer Graphene with Ultra Low Resistance for Next-Generation Interconnects

Enhancement of Thermal Conductivity and Mechanical Properties of Cu-Reduced Graphene Oxide Composites by Interface Modification

Interface optimization of graphene paper–Cu composite prepared by electrodeposition

Atomic and electronic structure of graphene oxide/Cu interface

High aspect ratio copper nanowires and copper nanoparticles decorated by reduced graphene oxide for flexible transparent conductive electrodes

Enhanced copper anticorrosion from Janus-doped bilayer graphene

Direct Electrochemical Synthesis of Reduced Graphene Oxide (rgo)/copper Composite Films and Their Electrical/Electroactive Properties

Interface Coupling of Octahedron Cu2o with Reduced Graphene Oxide for Enhanced Photocatalytic and Photoelectrochemical Activity

Mechanically strengthened graphene-Cu composite with reduced thermal expansion towards interconnect applications

Ultrathin graphene and graphene oxide layers as a diffusion barrier for advanced Cu metallization

Preparation and Characterization of Electroplated Cu/Graphene Composite

Improved Conductivity of Low‐Temperature‐Synthesized Graphene/Cu for CMOS Backend‐of‐Line Interconnect Applications

laminated Cu-GO-Cu composite foils with improved mechanical and thermal properties by alternating DC electro-deposition and electrophoresis