Abstract:The coplanar capacitive sensing method is considered a relatively novel electromagnetic technique in NDT. The size of the electrodes and the separation distance between them significantly affect the penetration depth, electric field strength, and sensitivity of the measurement. To achieve different penetration depths and electric field strengths, separate sensors with various sizes <span class="mjpage"><svg xmlns:xlink="http://www.w3.org/1999/xlink" width="1.162ex" height="2.843ex" style="vertical-align: -0.838ex;" viewBox="0 -863.1 500.5 1223.9" role="img" focusable="false" xmlns="http://www.w3.org/2000/svg"><g stroke="currentColor" fill="currentColor" stroke-width="0" transform="matrix(1 0 0 -1 0 0)"> <use xlink:href="#MJMAIN-2F" x="0" y="0"></use></g></svg></span> separations can be employed which is time-consuming. In order to reduce the costs and time, a multi-electrode sensor is designed and introduced in this paper. This type of sensor uses coplanar electrodes to generate the multiple fringing electric field to inspect the specimen. In this sensor, it is possible to have multiple driving and sensing electrodes at the same time, which provides a variety of different sizes and separation distances leading to various depths of penetration and electric field strengths. In the framework of this paper, the principle of the multi-electrode coplanar capacitive probe was explained. A 3D Finite Element Modelling (FEM) was employed to simulate and illustrate the electric field distribution from a multi-electrode coplanar capacitive sensor with different arrangements of driving and sensing electrodes, and how this field may be altered by changing the arrangement. The multi-electrode probe was manufactured and several sets of experiments were conducted under various conditions. The Measurement Sensitivity Distribution (MSD) was applied to characterise and interpret the variable output from the physical scan of the specimen. The case study on an acrylic sample comprised of defects with different depths demonstrated the feasibility of defect discrimination using a multi-electrode capacitive sensor.<svg xmlns="http://www.w3.org/2000/svg" style="display: none;"><defs id="MathJax_SVG_glyphs"><path stroke-width="1" id="MJMAIN-2F" d="M423 750Q432 750 438 744T444 730Q444 725 271 248T92 -240Q85 -250 75 -250Q68 -250 62 -245T56 -231Q56 -221 230 257T407 740Q411 750 423 750Z"></path></defs></svg>

Research on Multi-Method Endpoint Detection in Chemical Mechanical Planarization Process

An in Situ End-Point Detection System Using Motor Power Signal for Chemical Mechanical Planarization Process

Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing

Motor Power Signal Analysis for End-Point Detection of Chemical Mechanical Planarization

In-situ Cu Layer Thickness Measurement During Chemical Mechanical Planarization

Kinematic Analysis of in Situ Measurement During Chemical Mechanical Planarization Process.

A Reliable Control System for Measurement on Film Thickness in Copper Chemical Mechanical Planarization System.

Research on Synthetic Endpoint Detection During CMP

Signal Processing and Analysis for Copper Layer Thickness Measurement Within a Large Variation Range in the CMP Process.

Computational Investigation of a Novel Metal Thickness Measurement System with Coaxial Triple-Coil Sensor for Chemical Mechanical Polishing

Study on the Infrared Optical Endpoint Detection

Multi-Electrode Coplanar Capacitive Probe With Various Arrangements for Non-Destructive Testing of Materials

In-situ measurement of Cu film thickness during the CMP process by using eddy current method alone

Mechanism and Applications of Chemical and Mechanical Polishing

Research Progress of Material Removal Mechanism in Chemical Mechanical Planarization for Metal Interconnection Layer of Chips

Molecular Modeling of the Mechanical Effect in the Chemical Mechanical Polishing Process

Chemical mechanical polishing: Theory and experiment

Cu Layer Thickness Monitoring in CMP Process by Using Eddy Current Sensor

Evaluation of Post-Cu CMP Cleaning of Organic Residues Using Microfluidic Device

Tribo-Electrochemical Characterization of Ru, Ta and Cu CMP Systems Using Percarbonate Based Solutions

Endpoint Detection in High Density Plasma Etching System Based on IEP