Dual Al₂O₃/Hf₀.₅Zr₀.₅O₂ Stack Thin Films for Improved Ferroelectricity and Reliability

Yu-Chun Li,Xiao-Xi Li,Mao-Kun Wu,Bo-Yao Cui,Xue-Pei Wang,Teng Huang,Ze-Yu Gu,Zhi-Gang Ji,Ying-Guo Yang,David Wei Zhang,Hong-Liang Lu
DOI: https://doi.org/10.1109/led.2022.3185246
IF: 4.8157
2022-01-01
IEEE Electron Device Letters
Abstract:In this letter, a dual Al 2 O 3 /Hf 0.5 Zr 0.5 O 2 (HZO) stack structure ferroelectric (FE) capacitor was designed and fabricated. It is found that the dielectric (DE) Al 2 O 3 thin film at the middle position of FE HZO thin films could apparently affect the behaviors of the oxygen vacancies at DE/FE interface and the electric field distribution, thereby affecting the corresponding ferroelectricity and reliability. By modulating the thickness of Al 2 O 3 middle layer (ML), it is demonstrated that the FE capacitor with 1 nm Al 2 O 3 ML exhibits better FE and cycling properties, including wake-up free, weaker fatigue effect, and robust endurance. Specifically, the device performs a considerable remnant polarization ( $2{P}_{\mathrm {r}}$ ) of $36.2 ~\mu \text{C}$ /cm 2 with a coercive electric field ( $2{E}_{\mathrm {c}}$ ) of 2.7 MV and $2{P}_{\mathrm {r}} > 20 ~\mu \text{C}$ /cm 2 after 10 10 cycles at 3 MV/cm. This work paves the pathway to optimize the ferroelectricity and reliability for future FE application.
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