Effect of bonding time on reliability of Cu/Sn-9Zn-30Cu/Cu solder joints for 3D packaging
Yuezhang Yang,Zheng Liu,Li Yang,Yaocheng Zhang,Huiming Gao,Zhitao Zhang
DOI: https://doi.org/10.1007/s10854-024-13146-7
2024-07-15
Journal of Materials Science Materials in Electronics
Abstract:Cu/Sn-9Zn-30Cu/Cu 3D packaging solder joints were prepared by transient liquid phase (TLP) bonding. The effect of bonding time on microstructure, shear strength, and fracture surfaces of the solder joints was studied. The results show that the interface reaction zone of Cu/Sn-9Zn-30Cu/Cu solder joints consisted of Cu 6 (Sn, Zn) 5 phase and Cu 3 Sn phase at a bonding time of 15 min. With increasing bonding time, the scallop-type Cu 6 (Sn, Zn) 5 phase gradually transformed into the layer-type Cu 3 Sn phase, and the thickness of the interfacial intermetallic compound (IMC) layer gradually increased. The interfacial reaction zone entirely consisted of the layer-type Cu 3 Sn after bonding for 60 min. The in situ reaction zone of Cu/Sn-9Zn-30Cu/Cu solder joint consisted of Cu 6 (Sn, Zn) 5 , Cu 3 Sn, Cu particles, and Zn-rich phase at a bonding time of 15 min. The Cu 6 (Sn, Zn) 5 increased content and evenly distributed in the in situ reaction zone at 30 min, resulting the microstructure gradually refined. The Zn-rich phase disappeared in the in situ reaction zone after bonding 90 min, and the in situ microstructure gradually coarsened and cracks initiated as bonding time increased. The shear strength of solder joints first increased and then declined with increasing bonding time, and the maximum shear strength reached 22.25 MPa at a bonding time of 60 min. The fracture location of the solder joint shifted from the in situ reaction zone to the interface reaction zone with increasing bonding time, and the fracture mechanism of the solder joints always exhibited brittle fracture.
materials science, multidisciplinary,engineering, electrical & electronic,physics, applied, condensed matter