Enhanced interfacial bonding and mechanical properties of (TiC p +GNPs)/Cu composites by Ti-induced GNPs/Cu interfacial modification
Ying Zhang,Xiuhua Guo,Kexing Song,Shaolin Li,Jiang Feng,Kaiyue Duan,Junbiao Duan
DOI: https://doi.org/10.1016/j.jallcom.2023.170366
IF: 6.2
2023-05-14
Journal of Alloys and Compounds
Abstract:s Graphene reinforced copper matrix composites have wide application prospects due to its good electrical and thermal conductivity, mechanical properties and self-lubrication. However, weak interfacial bonding caused by the large difference in thermal expansion coefficient between Cu and GNPs is the main reason for the poor comprehensive performance of GNPs/Cu composites. In this study, (TiC p +GNPs)/Cu composites were successfully prepared by powder metallurgy and in-situ synthesis. The interfacial bonding was improved by in-situ reactions between titanium (Ti) and GNPs, which enhanced the comprehensive performance of GNPs/Cu composites obviously. Results show that TiC p was formed at the interface, accompanied Cu-Ti metallic compound in the matrix. The parallel orientation relationship ((01 1̅ ) CuTi // (0 1̅1̅ ) TiC // (200) CuTi2 ) of the TiC p to the Cu-Ti metallic compound was observed, which revealed the formation mechanism of TiC p . Furthermore, good interfacial bonding was realized and strengthening efficiency of GNPs was greatly improved by regulating sintering parameters. An optimal balance between ultimate tensile strength and impressively lager plastic deformation was achieved at 900 °C × 2 h. Simultaneously, the in-situ synthesized TiC p played rivet roles in strengthening GNPs/Cu interfacial bonding and preventing crack propagation, which was beneficial to improving mechanical properties of Cu matrix composites.
materials science, multidisciplinary,chemistry, physical,metallurgy & metallurgical engineering