Technological studies on diffusion bonding of Ti-6Al-4V/Cu/QAl10-3-1.5

Wei Guo,Xihua Zhao,Jicai Feng

2009-01-01

Abstract:The diffusion bonding of Ti-6Al-4V and QAl10-3-1.5 with Cu interlayer has been performed. The effect of diffusion bonding parameters (bonding temperature and holding time) on the tensile strength and the microstructures of joints was studied, and the fracture appearances of the joints with different parameters were observed. Last, the combining products of the transition zone in the joint were identified. The result shows that the diffusion bonding of Ti-6Al-4V and QAl10-3-1.5 with Cu interlayer can be carried out under certain technological parameters. And the optimum tensile strength of the joints reaches 225 MPa under the optimum parameters (850°C bonding temperaturet, 60 min holding time and 10 MPa bonding press). When the bonding temperature is lower (<830°C) or the holding time is shorter (<30 min), the fracture style of the joint belongs to brittle rupture. And the fracture style under optimum parameters is plastic and brittle mixture fracture. Continually increasing bonding temperature or holding time, the brittleness of the joint increases and the plasticity decreases. The whole transition zone of the joint from QAl10-3-1.5 to Ti-6Al-4V is QAl10-3-1.5/Cu/Cu(ss. Ti)/CuTi3/Ti(ss. Cu)/β-Ti/Ti-6Al-4V.