Demonstration of Vertically-stacked CVD Monolayer Channels: MoS<sub>2</sub> Nanosheets GAA-FET with I<sub>on</sub>&gt;700 A/m and MoS<sub>2</sub>/WSe<sub>2</sub> CFET

Xiong Xiong,Anyu Tong,Xin Wang,Shiyuan Liu,Xuefei Li,Ru Huang,Yanqing Wu
DOI: https://doi.org/10.1109/IEDM19574.2021.9720533
2021-01-01
Abstract:Vertical stacking of atomic layer thin channel has been challenging due to the top-gate dielectric integration and complicated process, which typically yield in deteriorated performance. In this work, we demonstrate the 2-monolayer-MoS2-stacked nanosheets with a sequentially layer-by-layer fabrication process using a gate-all-around fashion. Compared with the 1-channel back-gate transistor, the 2-channel stacked nanosheets (SN) transistor exhibits more than twice of gm improvement. The high I-on >400 mu A/mu m per channel footprint at V-d=1 V is achieved due to short gate length of 100 nm, and low contact resistance of 0.77 k Omega*mu m. Statistics of hundreds of devices with various channel lengths show the performance evolution trend and monolithic integration potential based on the large-scale CVD-grown 2D materials. Furthermore, the vertical-stacked MoS2/WSe2 complementary FETs (CFETs) based on CVD grown are also demonstrated for the first time with about 50% footprint reduction, as compared to the planar devices.
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