NBTI Mitigation by Optimized HKMG Thermal Processing in a FinFET Technology

Bin Ye,Yi Gu,Hang Xu,Chengkang Tang,Hao Zhu,Qingqing Sun,David Wei Zhang
DOI: https://doi.org/10.1109/ted.2021.3139566
IF: 3.1
2022-01-01
IEEE Transactions on Electron Devices
Abstract:It has become more challenging to suppress the negative bias temperature instability (NBTI) in advanced FinFET technology which is largely originated from the dielectric/channel interface in HKMG structure. In this work, we report the experimental approach to mitigate the NBTI in 14-nm FinFET devices through HKMG thermal processing optimization. The NBTI reliability degradation arises from the formation of defective SiO2 interlayer and the interface traps based on a quantitative analysis. Using optimized post-dielectric annealing (PDA) and post-Si-cap annealing (PCA) processing, an improved balance between the SiO2 interlayer quality and high- ${k}$ /SiO2 interface trap density has been achieved. The NBTI ${V}_{t}$ shift and device local variation are effectively suppressed. This provides an instructive pathway to enhance the NBTI reliability in FinFET through process optimization approaches.
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