Improved Positive Bias Temperature Instability of N-Type Vertical C-Shaped-Channel Nanosheet FET by Forming Gas Annealing

Yunfei Shi,Songyi Jiang,Hong Yang,Yongkui Zhang,Longda Zhou,Zhigang Ji,Qianqian Liu,Qi Wang,Huilong Zhu,Jun Luo,Wenwu Wang
DOI: https://doi.org/10.1109/ipfa61654.2024.10690896
2024-01-01
Abstract:In this article, the influence of Forming Gas Annealing (FGA) on the Positive Bias Temperature Instability (PBTI) characteristics of n-vertical C-shaped-channel nanosheet FET (n-VCNFET) is studied. The experimental results show that the extra FGA can significantly suppress both the initial and generated interface traps in PBTI. Moreover, in ultra-fast PBTI the pre-existing trap and total trap of VCNFET due to FGA decreases by 35% and 31%, respectively. The energy level of the oxide trap under PBTI and recovery doesn't change, in other words, the FGA induces the oxide trap density of the devices to decrease by 36% at 125°C and 1.4V Vov. The optimization effect of FGA annealing has been further confirmed from the perspective of trap generation. It provides a guideline for the PBTI improvement of VCNFET in trap scopes.
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