Abstract:Ceria (CeO2)-based abrasives are widely utilized in ultra-precision grinding and chemical mechanical polishing (CMP) applications over silica materials due to their unique physicochemical properties. Both mechanical and chemical contributions to polishing processes are highly affected by the size, shape, structure, component, defect of CeO2 abrasives. Herein, the composites involved mesoporous silica (mSiO2) cores and La- or Yb-doped CeO2 shells were synthesized and characterized in terms of X-ray diffractometry, scanning electron microscopy, transmission electron microscopy, Raman spectroscopy, scanning transmission electron microscopy–energy dispersive X-ray mapping methods. The polishing effectiveness of the proposed composites toward quartz glass was experimentally evaluated under both CMP and ultraviolet irradiation-assisted photochemical mechanical polishing (PCMP) conditions. The polishing results indicated that the low-modulus mSiO2 cores strongly exerted the cushion effects for the friction and abrasion to substrates. Consequently, the heterostructured mSiO2/La-CeO2 and mSiO2/Yb-CeO2 abrasive systems offered nearly non-damage and ultra-smooth surfaces with angstrom-level roughness compared to conventional rigid abrasives. The enriched Ce3+ and oxygen vacancy defects at La- and Yb- doped CeO2 surfaces were responsible for the improvements of tribochemical and photochemical activities, thus allowing evidently enhanced removal efficiency with the assistance of ultraviolet irradiation. A possible polishing mechanism on the multi-component abrasive systems was also proposed.

E36 Fixed-abrasive Dry Polishing of Fused Silica in Conjunction with Ultrasonic Vibrations

Polishing fused silica glass by incorporating ultrasonic vibration into fixed abrasive polishers

Investigation into Chemo-Mechanical Fixed Abrasive Polishing of Fused Silica with the Assistance of Ultrasonic Vibration

Hybrid Polishing of Fused Silica Glass with Bound-Abrasive Polishers in Conjunction with Vibration

Precision Manufacturing Of Fused Silica Glass By Combining Bound-Abrasive Polishing With Ultrasonic Vibration

Vibration-assisted dry polishing of fused silica using a fixed-abrasive polisher

An Experimental Investigation on Ultrasonic Vibration-Assisted Grinding of SiO2f/SiO2Composites

Tentative Investigation Towards Precision Polishing of Optical Components with Ultrasonically Vibrating Bound-Abrasive Pellets.

2207 Effects of Ultrasonic Vibration on Abrasive Pellet Working Life for Si Wafer Using Ultrasonic Assisted Fixed Abrasive Chemical Mechanical Polishing(UF-CMP)

Mechanism of Surface Formation of Silicon Wafer Processed by Fixed Abrasive Polishing with Assistance of Ultrasonic Vibration and Experiments

E24 High Efficiency Mirror Finishing of Si Wafer Using Chemical-Mechanical Machining of Fixed Abrasive Assisted Ultrasonic Vibration

Achieving Ultralow Surface Roughness and High Material Removal Rate in Fused Silica Via a Novel Acid SiO2 Slurry and Its Chemical-Mechanical Polishing Mechanism

Study of the Humidity-Controlled CeO2 Fixed-Abrasive Chemical Mechanical Polishing of a Single Crystal Silicon Wafer

Trivalent lanthanum and ytterbium doped meso-silica/ceria abrasive systems toward chemical mechanical polishing (CMP) and ultraviolet irradiation-assisted photochemical mechanical polishing (PCMP)

Effects of the Ultrasonic Flexural Vibration on the Interaction Between the Abrasive Particles; Pad and Sapphire Substrate During Chemical Mechanical Polishing (CMP)

Ultrasonic vibration–assisted polishing of cylindrical groove arrays on silicon carbide

Effect of ultrasonic vibration on polishing monocrystalline silicon: surface quality and material removal rate

Performance Improvement of Chemo-Mechanical Grinding in Single Crystal Silicon Machining by the Assistance of Elliptical Ultrasonic Vibration

0705 Ultra Precision Surface Polishing of Fused Silica Using MCF Wheel Based on Prolongation of Wheel Life

Surface Observations and Material Removal Mechanisms in Rotary Ultrasonic Machining of Brittle Material

Experimental Research On Ultrasonic Torsional Vibration-Assisted Grinding Of Hard And Brittle Materials