Abstract:Axial ultrasonic vibration-assisted face grinding (AUVAFG) of SiC has the characteristics of high efficiency and serious damage. With the aim of solving the problem of serious surface damage in AUVAFG of SiC ceramics, a composite ultrasonic vibration-assisted face grinding (CUVAFG) method involving axial vibration and elliptic vibration is proposed, which not only ensures the high efficiency but also maintains high quality of the machined surface. In this paper, the grinding forces and the surface quality were investigated by conducting comparative experiments on axial and composite ultrasonic vibration-assisted face grinding using a single diamond. The effects of ultrasonic vibration amplitude and wheel speed on grinding forces, ground surface roughness, and ground surface morphology were analyzed to reveal the brittle-ductile removal behavior of SiC ceramics during the micro-cutting process caused by elliptic ultrasonic vibration. The results show that CUVAFG can effectively reduce the grinding forces by about 15%, reduce the ground surface roughness by approximately 40.7%, and induce ductile removal to acquire good surface finish with predominantly facets in comparison to AUVAFG. More specifically for CUVAFG, with increased elliptic ultrasonic vibration amplitude along the long axis, the grinding forces are reduced by minor amplitude, but remain constant in the case of major amplitude. When the elliptic vibration amplitude is close to the critical chip thickness of brittle-ductile transition, the number of facets on workpiece surface is the highest, but the grinding forces and the surface roughness are relatively low. Meanwhile, with the increase of wheel speed, the number of facets and the proportion of ductile removal are both increased, but the grinding forces and the surface roughness are decreased. In order to realize low-damage machining of SiC ceramics by CUVAFG, it is suggested to keep the elliptic ultrasonic vibration amplitude around the critical chip thickness of brittle-ductile transition and use minor axial ultrasonic vibration amplitude and high wheel speed to achieve lower grinding forces and good surface quality.

Performance Improvement of Chemo-Mechanical Grinding in Single Crystal Silicon Machining by the Assistance of Elliptical Ultrasonic Vibration

Experimental Investigation on Hybrid Technology of Ultrasonic Vibration Assisted Chemo-Mechanical Grinding (CMG) Silicon Wafer

An Experimental Investigation on Ultrasonic Vibration-Assisted Grinding of SiO2f/SiO2Composites

Effect of Ultrasonic Vibration Assisted Grinding Process on Surface Topography and Properties of C/SiC Composite

Two Dimensional Ultrasonic Vibration Assisted Chemo-Mechanical Grinding of Si Wafer

A New Two-Dimensional Ultrasonic Assisted Grinding (2D-Uag) Method and Its Fundamental Performance in Monocrystal Silicon Machining

Surface Formation Characteristics in Elliptical Ultrasonic Assisted Grinding of Monocrystal Silicon

Two Dimensional Ultrasonic Vibration Assisted Chemical Mechanical Grinding and Experiment on Si Wafer

Surface quality and cylindricity of ultrasonic elliptical vibration–assisted centerless grinding of micro-rod YAG single crystals

Wear Characteristics of Diamond Wheel in Elliptical Ultrasonic Assisted Grinding (euag) of Monocrystal Silicon

Development of a Two-dimensional Ultrasonic Vibration Assisted Grinding Technique of Monocrystal Silicon

S1302-1-3 Characteristics of Two-dimensional Ultrasonic Vibration Assisted Grinding of Monocrystal Silicon

Material removal mechanism of SiC ceramics by elliptic ultrasonic vibration-assisted grinding (EUVAG) using single grain

2207 Effects of Ultrasonic Vibration on Abrasive Pellet Working Life for Si Wafer Using Ultrasonic Assisted Fixed Abrasive Chemical Mechanical Polishing(UF-CMP)

Two-dimensional ultrasonically assisted grinding of monocrystal silicon

A Fundamental Investigation on Ultrasonic Assisted Fixed Abrasive CMP (UF-CMP) of Silicon Wafer

Fundamental Machining Characteristics of Ultrasonic Assisted Internal Grinding of SiC Ceramics

Axial and composite ultrasonic vibration-assisted face grinding of silicon carbide ceramics: grinding force and surface quality

Investigation on surface formation mechanism in elliptical ultrasonic assisted grinding (EUAG) of monocrystal sapphire based on fractal analysis method

Experimental Investigations of Grinding Forces in Elliptical Ultrasonic Assisted Grinding (euag) of Monocrystal Sapphire

Study on Effect of Ultrasonic Vibration on Grinding Force and Surface Quality in Ultrasonic Assisted Micro End Grinding of Silica Glass