Abstract:Considering the technical status and existing problems of traditional silicon wafer chemical mechanical polishing (CMP), especially for the diameter of silicon wafer increasing, constantly, the surface quality and efficiency of silicon wafer polishing are becoming an urgent problem to be solved, so the research subject of ultrasonic vibration hybrid polishing new technique was proposed. By means of mechanism theoretical analysis research, firstly, the processing mechanism of hybrid polishing was studied systematically. An investigation of polishing mechanisms based on the micro-contact model between the polishing pad and the polishing surface of silicon wafer was developed. Polishing mechanism theoretical analysis shows that when ultrasonic vibrations combined with mechanical and chemical, the performance of polishing slurry is improved in the process of CMP, therefore to create favorable conditions. To verify the established theory, then, a series of experiments to investigate the traditional CMP are conducted, as well as the polishing tool with the forms of ultrasonic vibration, the polishing pad, the polishing surface quality, velocity at polishing point v, and slurry supplying Q on silicon wafer polishing. Experiment findings showed that, in the same polishing conditions, especially, hybrid polishing by ultrasonic-elliptic-vibration has gained more advantage over the effect of silicon wafer polishing. When ultrasonic-elliptic-vibration is put in polishing tool, the silicon wafer polished surface roughness Ra from the traditional method of polishing 0.077μm going down to the 0.042μm, the no-smooth rate KR which describes the polished surface morphology is significantly improved, and the material removal rate increases by 18%. Experimental research findings of the surface quality and the material removal mechanism are shown to be consistent with the theoretical analysis.

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Experimental Investigation on Hybrid Technology of Ultrasonic Vibration Assisted Chemo-Mechanical Grinding (CMG) Silicon Wafer

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Two Dimensional Ultrasonic Vibration Assisted Chemo-Mechanical Grinding of Si Wafer

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Precision Manufacturing Of Fused Silica Glass By Combining Bound-Abrasive Polishing With Ultrasonic Vibration

Performance Improvement of Chemo-Mechanical Grinding in Single Crystal Silicon Machining by the Assistance of Elliptical Ultrasonic Vibration

Two Dimensional Ultrasonic Vibration Assisted Chemical Mechanical Grinding and Experiment on Si Wafer

E36 Fixed-abrasive Dry Polishing of Fused Silica in Conjunction with Ultrasonic Vibrations

A Fundamental Investigation on Ultrasonic Assisted Fixed Abrasive CMP (UF-CMP) of Silicon Wafer

Mechanism and Experimental Investigation on Silicon Wafer Hybrid Polishing by Ultrasonic-Elliptic-Vibration Chemical-Mechanical

A Hybrid Technique of Ultrasonic-Elliptic-Vibration-Assisted Chemical-Mechanical Polishing and its Experimental Investigation

A Feasibility Study of Silicon Wafer Edge Treatment by Ultrasonic Assisted Fixed-Abrasive CMP (UF-CMP)

Study on Improving the Precise Machinability of Single Crystal SiC by an Ultrasonic-Assisted Hybrid Process

High precision polishing of aluminum alloy mirrors through a combination of magnetorheological finishing and chemical mechanical polishing

Experiment on silicon wafer edge hybrid polishing of ultrasonic vibration and chemical mechanical

Surface Flatness and Roughness Synchronized Control in CMP Process of Silicon Mirror