Corrections to “copper Anisotropy Effects in Three-Dimensional Integrated Circuits Using Through-Silicon Vias” [jun 12 225-232]

Aditya P. Karmarkar,Xiaopeng Xu,Kong-Boon Yeap,Ehrenfried Zschech
DOI: https://doi.org/10.1109/tdmr.2012.2209531
IF: 1.886
2012-01-01
IEEE Transactions on Device and Materials Reliability
Abstract:In the above titled paper (ibid., vol. 12, no. 2, pp. 225-232, June 2012), Fig. 1 did not appear correctly. The corrected Fig. 1 is presented here.
What problem does this paper attempt to address?