Abstract:Effective thermal conduction between solid interfaces has emerged as a major bottleneck in heat dissipating heat from new-generation high-performance electronics. Gallium-based liquid metals (LMs), known for their high thermal conductivity, are gaining significant traction as thermal interface materials (TIMs) for enhanced thermal management. In this work, to address the key issues facing the application of gallium-based LMs as TIMs, including the lack of composition ratio data, poor coating performance and the need for improved thermal conductivity, two types of gallium-based LM-TIMs (Ga-In binary LM-TIMs and Ga-In-Sn ternary LM-TIMs) with different composition ratios were experimentally prepared, investigated and optimized. The thermal conductivities of the LM-TIMs at different temperatures (80 - 120 ℃) were tested, and the application reliability of the LM-TIMs was optimized by continuously destructing the oxide layer and filling micro copper particles. The influence of optimization parameters such as the duration of the destruction of oxide layer, the filling ratios of the particles and the particle size on the operation performance of the LM-TIMs was studied and analyzed. The results showed that the LM-TIMs exhibited excellent thermal conductivities of 29.6 - 38.5 W/(m·K), and the thermal conductivity increased with indium mass fraction and decreased with tin mass fraction. Significant improvements in coating performance were observed with the increase of the duration of destructing oxide layer, but it led to a reduction in thermal conductivity. Balancing coating performance and thermal conductivity, it was found that 30 min was the ideal duration. The filling of micro particles made up for the reduced thermal conductivity, and higher filling ratios and smaller particle sizes achieved better enhancement. In the experiment, a filling ratio of 5 % was appropriate because solidification occurred in LM-TIMs at higher filling ratios which weakened the thermal conductivity. This work provided valuable reference for the application and optimization of high thermal conductive gallium-based LM-TIMs.

Wettability and Thermal Performance of Ga62.5In21.5Sn16 Liquid Metal Alloy on W-coated Cu Substrates with Varying Film Thickness

Experimental Investigation on Optimization of the Performance of Gallium-Based Liquid Metal with High Thermal Conductivity As Thermal Interface Material for Efficient Electronic Cooling

Tungsten Joining with Copper Alloy and Its High Heat Load Performance

Renal transplantation in children younger than 6 years old.

Enhanced Wettability of Gallium-Based Liquid Metal Alloys on Copper Films by Promoting Intermetallic Reactions

Interfacial reactions at Ga-21.5In–10Sn/Cu liquid-solid interfaces under isothermal and non-isothermal conditions

Electrodeposited Ni-W coatings as the effective reaction barrier at Ga-21.5In-10Sn/Cu interfaces

Interface microstructures in the wetting of Cu by equiatomic GaInSnBiZn high-entropy alloy

Wetting Behavior and Interfacial Characteristics in the Molten Bi-Sn/High-Entropy Alloy System

Effects of High-Temperature Treatment on the Reaction Between Sn-3%Ag-0.5%Cu Solder and Sputtered Ni-V Film on Ferrite Substrate

Oxide‐Mediated Formation of Chemically Stable Tungsten–Liquid Metal Mixtures for Enhanced Thermal Interfaces

Minimizing Interface Thermal Resistance Via Laser Surface Micropatterning for Enhancing Wetting of Gallium-Based Liquid Metal with Copper

Liquid Phase Separation Microstructure and Properties of Mixed Cu-Sn and Co-Base Alloys Without or with Molybdenum Addition Processed by Plasma Transferred Arc Hardfacing

Metallic Bond-Enabled Wetting Behavior at the Liquid Ga/CuGa2 Interfaces

EFFECTS OF THE ADDITION OF Ti OR Al ON THE WETTING BEHAVIORS AND INTERFACIAL CHARACTERISTICS OF Zr 50 Cu 50 BULK METALLIC GLASS/W SUBSTRATE

Wetting Behavior of Gallium-Based Room Temperature Liquid Metal (LM) on Nanosecond-Laser-structured Metal Surfaces

Investigation on the Interfacial Stability of Multilayered Cu–W Films at Elevated Deposition Temperatures During Co-Sputtering

Thermal performance and heat transfer mechanism of EGa-In-Sn/W composite thermal interface materials

Improving the Wettability and Lubrication Properties of Gallium-Based Liquid Metal Through the Reaction Adsorption of Copper and Gallium

Temperature-dependent liquid metal embrittlement of Al 0.7 CoCrFeNi high-entropy alloys induced by equiatomic GaInSnZn melts

Improving the thermal, mechanical, and insulating characteristics of thermal interface materials with liquid metal-based diphase structure