Metallization Reliability of GaN-Based High-Voltage Light-Emitting Diodes

Jiaxin Chen,Jialu Wang,Mengmei Li,Weiling Guo,Lifan Shen,Xin Yang,Jie Sun
DOI: https://doi.org/10.1109/TDMR.2021.3108541
IF: 1.886
2021-01-01
IEEE Transactions on Device and Materials Reliability
Abstract:Electromigration is one of the most stubborn and serious reliability failure mechanisms in interconnection wires. Specifically, there is a high risk of electromigration in the special metal interconnection electrode structure of high-voltage light-emitting diodes (HV-LEDs). Nevertheless, a systematic investigation on this issue is lacking in literature. Here, simulations and experiments were condu...
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