Abstract:Recently, metallization on polymer substrates has been given more attention due to its outstanding properties of both plastics and metals. In this study, the metal oxide composite of copper-chromium oxide (CuO·Cr2O3) was incorporated into the polymer matrix to design a good laser direct structuring (LDS) material, and the well-defined copper pattern (thickness =10 μm) was successfully fabricated through selective metallization based on 1064 nm near-infrared pulsed laser activation and electroless copper plating. We also prepared polymer composites incorporated with CuO and Cr2O3; however, these two polymer composites both had very poor capacity of selective metallization, which has no practical value for LDS technology. In our work, the key reasons causing the above results were systematically studied and elucidated using XPS, UV-vis-IR, optical microscopy, SEM, contact angle, ATR FTIR, and so on. The results showed that 54.0% Cu2+ in the polymer composite of CuO·Cr2O3 (the amount =5 wt %) is reduced to Cu0 (elemental copper) after laser activation (irradiation); however, this value is only 26.8% for the polymer composite of CuO (the amount =5 wt %). It was confirmed that to achieve a successful selective metallization after laser activation, not only was the new formed Cu0 (the catalytic seeds) the crucial factor, but the number of generated Cu0 catalytic seeds was also important. These two factors codetermined the final results of the selective metallization. The CuO·Cr2O3 is very suitable for applications of fabricating metallic patterns (e.g., metal decoration, circuit) on the inherent pure black or bright black polymer materials via LDS technology, which has a prospect of large-scale industrial applications.

Fabrication of Copper Patterns on Polydimethylsiloxane Through Laser-Induced Selective Metallization

Fabricating Metallic Circuit Patterns on Polymer Substrates Through Laser and Selective Metallization.

Fabrication of metallic patterns on ordinary polymer substrates by laser direct activation and electroless plating

Selective Metallization Induced by Laser Activation: Fabricating Metallized Patterns on Polymer Via Metal Oxide Composite

Exposing Metal Oxide with Intrinsic Catalytic Activity by Near‐Infrared Pulsed Laser: Laser‐Induced Selective Metallization on Polymer Materials

Laser-Induced Selective Metallization on Polymer Substrates Using Organocopper for Portable Electronics

Selective Metallization of Thermoplastic Elastomers Based on Laser‐Induced Surface Activation

Laser Direct Activation of Polyimide for Selective Electroless Plating of Flexible Conductive Patterns

Rapid Selective Metal Patterning on Polydimethylsiloxane (PDMS) Fabricated by Capillarity-Assisted Laser Direct Write

Laser-Induced Selective Metallization on Polymers for Both NIR and UV Lasers: Preparing 2D and 3D Circuits

Efficient and Simple Fabrication of High-Strength and High-Conductivity Metallization Patterns on Flexible Polymer Films

Fabrication of Conductive Copper Patterns Using Reactive Inkjet Printing Followed by Two-Step Electroless Plating

Single-step Selective Metallization on Insulating Substrates by Laser-Induced Molten Transfer

Selective Metallization on Ordinary Polymer Substrates by Laser Direct Activation of Copper Phosphate or Nickel Phosphate

Scalable Strategy to Directly Prepare 2D and 3D Liquid Metal Circuits Based on Laser-Induced Selective Metallization

Fabrication of Conductive Copper Patterns Using Photocatalyst-activated Electroless Deposition

Fabrication of flexible copper patterns by electroless plating with copper nanoparticles as seeds

Preparation of Electroless Copper Circuit on Polycarbonate/ Acrylonitrile Butadiene Styrene (PC/ABS) Using a Laser curing of Pd complex

High-adhesion Cu patterns fabricated by nanosecond laser modification and electroless copper plating

Higher-resolution Selective Metallization on Alumina Substrate by Laser Direct Writing and Electroless Plating

3D Porous Polysiloxane Ion-Adsorption Films for Additive Fabrication of Conductive Patterns with High Adhesion