Abstract:The orientation and distribution of nanotwins were regulated by the addition of gelatin during direct current electroplating copper films. Columnar grains with vertically orientated nanotwins were obtained without or with minor addition of gelatin (1 ppm). When 25 ppm gelatin was added, a bi-layered microstructure was formed. High-density horizontal nanotwins were formed near surface, while vertically orientated nanotwins were obtained near substrate. Bottom-up columnar grains with high-density horizontal nanotwins were formed with an appropriate concentration. However, when the concentration of gelatin further increased to 100 ppm, the microstructure was refined into equiaxed grains with a few nanotwins. Three-dimensional (3D) microstructure was constructed based on the electron back-scatter diffraction and focus ion beam observation. And the growth mechanism for microstructural evolution from vertical orientated nanotwins to horizontal orientated nanotwins was attributed to the increasing inhibition intensity based on the analysis of electrochemical behavior. Notably, a modified gelatin-controlled Winand growth model was proposed in order to describe the microstructural evolution of nanotwin's orientation and distribution. Further, the contributions of grain refinement and nanotwin strengthening on mechanical properties were discussed.

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