The Role of Active Cu Interlayer in Adjusting the Interfacial Reaction and Microstructure of Cf/C-DD3 Joints

Xiaoqing Si,Xiajun Guo,Chun Li,Shuhui Zhao,Yongxu Liu,Jian Cao
DOI: https://doi.org/10.1016/j.jmapro.2021.09.022
IF: 5.684
2021-01-01
Journal of Manufacturing Processes
Abstract:Due to the formation of excessive brittle compounds, the joint of C-f/C composites and single crystal Ni-based superalloy (DD3) has relatively low mechanical properties, greatly degrading the reliability of joints. In this work, an active Cu interlayer is introduced to adjust the interfacial reaction and microstructure of the joint. Effects of the Cu interlayer on the interfacial reaction and microstructure of joints are investigated in detail. Especially, the effect of the Cu interlayer on the joining stability of the joint is first analyzed, and its enhancement mechanism is further clarified. Adding an active Cu interlayer prevents the intense diffusion of Ni and Al from the DD3 side to the C-f/C side by a reactive adjusting process. Therefore, brittle AlNi2Ti phases only can be formed in the region nearby the DD3. Besides, the content of the Cu solid solution in the brazed seam is increased, significantly improving the plastic deformation ability of the joint. The maximum shear strength of C-f/C-DD3 joints with the Cu interlayer reaches to 54 MPa, approximately 50% higher than that of the joint without the Cu interlayer. Furthermore, a stable joint strength is obtained in a broader brazing temperature range from 880 degrees C to 940 degrees C.
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