Effect of Cu interlayer on interfacial microstructure of SiC ceramic/stainless steel brazed joints

Jian Cao,He Zhao,GuoRui Jin,Jicai Feng

2009-01-01

Abstract:Using Cu foil as stress relief interlayer, brazing of SiC ceramic to 304 stainless steel was successfully achieved with Ag-Cu-Ti filler metal. The interfacial microstructure was analyzed by scanning electron microscopy and energy dispersive spectrum analysis. The study put emphasis on the effect of Cu foil thickness on the interfacial microstructure and joining results. The results indicated that all 40 μm Cu interlayer reacted after brazing process and the crack was observed in the joint. When the 200 μmCu interlayer was applied, the bulk copper-rich solid solution was generated in the joint. The heat stress was released and no crack was observed in the joint. When the 900 μm Cu interlayer was used, the continue unreacted Cu layer was residual. The stress was released greatly, which resulted in the crack-free brazing joining. The mechanical properties of joint using 200 μm Cu and 900 μm Cu interlayer were measured. It was noted that both cracks propagated in the SiC ceramic. The highest shear strength of the joint reached 98 MPa.