Effect of Cu foam on the microstructure and strength of the SiCf/SiC-GH536 brazed joint

Yu Zhang,Xuming Guo,Wei Guo,Hongqiang Zhang,Tianwei Shao,Ziliang Yu
DOI: https://doi.org/10.1016/j.ceramint.2022.01.167
IF: 5.532
2022-05-01
Ceramics International
Abstract:The AgCuTi filler and Cu foam interlayer were used to braze silicon carbide fiber-reinforced silicon carbide matrix composites (SiCf/SiC) and nickel-based superalloy. Cu foam interlayer could reduce the brittle reaction layer on the SiCf/SiC side by diluting the brazing seam by producing Cu-based solid solution (Cu(s,s)) to inhibit Ti diffusion from the brazing filler. Cu foam did not completely disappear in the brazed joints and still maintained the basic skeleton. Sound SiCf/SiC-GH536 joints were obtained with AgCuTi filler at 890 °C for 10 min. Compared to the brazed joints without Cu foam, introducing Cu foam could enhance the overall shear strength of the brazed joints by 224%. Cu foam buffer layers provided a technique for increasing the mechanical properties of joints, promoting the use of SiCf/SiC composites in a wide range of applications.
materials science, ceramics
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