Microstructure and Annealing Behavior of Three Rolled Pure Tungsten Plates with Different Thickness Reduction

Kang Wang,Ya Xi,Xiang Zan,Laima Luo,Yucheng Wu

DOI: https://doi.org/10.1016/j.fusengdes.2021.112863

IF: 1.905

2021-01-01

Fusion Engineering and Design

Abstract:The annealing behaviors of three rolled pure tungsten plates with different thicknesses reduction ratios were investigated by hardness degradation during isothermal annealing at 1250 degrees C. The microstructures and textures of three rolled pure tungsten plates in the as-received and fully recrystallized states were characterized by Electron Backscatter Diffraction (EBSD). The stored energies of the plates in the as-received state were calculated through the specific surface density of high angle boundaries and low angle boundaries. All three plates undergo recrystallization and grain growth without an obvious recovery stage during the annealing process at 1250 degrees C. The recrystallization rate increases with the increased rolling thickness reduction ratios, which can be reasonably explained as the initial microstructure of the tungsten plate with the large rolling thickness reduction ratio has more dynamic recrystallization nuclei/grains and higher stored energy. The rolled and the recrystallized texture were both strengthened with the increased thickness reduction ratios, and the rolled texture is more random than the recrystallized one.