Study of inhibition mechanism of glycine on the electrochemical behavior of Mo in the alkaline slurry

Guang Yang,Hui Feng,Xu Wang,Xin-Ping Qu

2015-01-01

Abstract:We have found that glycine has inhibition effect on the CMP of Molybdenum (Mo) in alkaline slurry using H2O2 as oxidizer. In this work the inhibition mechanism is investigated using pontentiodynamic polarization, static etch and XPS.

What problem does this paper attempt to address?

Inhibition Effect of Glycine on Molybdenum Corrosion During CMP in Alkaline H2O2 Based Abrasive Free Slurry

Guang Yang,Peng He,Xin-Ping Qu

DOI: https://doi.org/10.1016/j.apsusc.2017.08.140

IF: 6.7

2018-01-01

Applied Surface Science

Abstract:The inhibitory effect of glycine on corrosion and chemical mechanical polishing (CMP) of Mo in hydrogen peroxide (H2O2) based abrasive-free alkaline slurry has been investigated. Results show that, in H2O2 based slurry, both static etching rate (SER) and removal rate (RR) of Mo during chemical mechanical polishing were reduced by adding glycine and the inhibition efficiency was around 50%. From ex-situ and in-situ open circuit potential (OCP), current density transient and potentiodynamic polarization measurements, it is found that formation of oxides was delayed due to blocked contact between oxidizer and the sample surface by electrostatic adsorption of glycine zwitterion on the surface. Glycine can form complex with MoO3 and promote dissolution of surface oxide, MoO3, resulting in a reduced passivation layer. The slowed oxidation reaction dominates the whole process, resulting inhibited Mo corrosion and leading to a smoother Mo surface. (C) 2017 Published by Elsevier B.V.
Effect of glycine on CMP process of molybdenum

Hui Feng,Li-Ao Cao,Xin-Ping Qu

DOI: https://doi.org/10.1109/ICSICT.2014.7021189

2014-01-01

Abstract:The effect of glycine on CMP of Mo using H2O2 based alkaline slurry is investigated. It is found that both removal rate (RR) and static etch rate(SER)decrease after adding glycine into the alkaline slurry. Higher concentration of glycine results in a lower RR. The in-situ OCP experiment results reveal that after adding glycine into the slurry, the chemical reaction becomes weaker and less amount of oxide forms. The mechanism of glycine's inhibition to CMP of Mo is due to physical adsorption between the glycine molecule and the Mo surface.
Investigation on Inhibition of Ruthenium Corrosion by Glycine in Alkaline Sodium Hypochlorite Based Solution

Shuai Shao,Bingbing Wu,Peng Wang,Peng He,Xin-Ping Qu

DOI: https://doi.org/10.1016/j.apsusc.2019.144976

IF: 6.7

2019-01-01

Applied Surface Science

Abstract:Removal of Ru by etching in alkaline sodium hypochlorite (NaClO) based solution is carried out. The glycine on the corrosion of Ru in NaClO based solution is systematically investigated. The results show that in the alkaline NaClO solution, glycine is a good corrosion inhibitor for Ru. Through electrochemical measurements, electrochemical quartz crystal microbalance (EQCM) and X-Ray photoelectron microscopy (XPS) measurements, it is found that the glycine adsorption isotherm on the Ru surface follows TEMKIN's model. Glycine can not only adsorb on the Ru surface to inhibit the corrosion of Ru, but also promote the dissolution of the formed oxide layer through complexing action. Finally, we use glycine and NaClO for chemical mechanical polishing (CMP) of the Cu/Ru interconnect structure and the removal rate selectivity of Cu and Ru can be adjusted to 1:1.
Synergetic effect of H 2 O 2 and glycine on cobalt CMP in weakly alkaline slurry

liang jiang,yongyong he,yan li,jianbin luo

DOI: https://doi.org/10.1016/j.mee.2014.02.002

IF: 2.3

2014-01-01

Microelectronic Engineering

Abstract:Cobalt has been selected as one of the most promising candidates of barrier metals for the next-generation ultra-large scale integrated circuits. This paper investigated the synergetic effect of oxidizer like H2O2 and complexing agent like glycine on the cobalt polishing performance. It is revealed that the cobalt static etching rate (SER) and removal rate (RR) are gradually suppressed with increasing pH due to the formation of compact and passive cobalt oxides on the cobalt surface, and the addition of high concentration of H2O2 can further reduce the cobalt RR. However, by the synergetic effect of H2O2 and glycine at pH 8.00, the cobalt SER and RR can be enhanced due to the formation of soluble Co(III)-glycine complex. (C) 2014 Elsevier B.V. All rights reserved.
Chemical Mechanical Polishing of Mo Using H2O2 as Oxidizer in Colloidal Silica Based Slurries

Xin-Ping Qu,Guang Yang,Peng He,Hui Feng

DOI: https://doi.org/10.1149/2.0351707jss

IF: 2.2

2017-01-01

ECS Journal of Solid State Science and Technology

Abstract:Chemical mechanical polishing (CMP) of molybdenum (Mo) using H2O2 based slurry with colloidal silica as abrasives has been systematically investigated. Effects of pH values, abrasives and additive of the slurry on CMP of Mo were investigated respectively. Results show that by adding ammonium sulfate (AS) in the alkaline H2O2 based slurry, both static etch rate (SER) and removal rate (RR) of Mo became much greater than without adding AS because of formation of a highly soluble (NH4)(2)MoO4. It is found that colloidal silica abrasive particles could adsorb on the Mo surface and have inhibitory effect on corrosion and polishing of Mo, and the higher concentration of colloidal silica particles, the lower SER and RR. AS addition in the slurry would enhance this phenomenon. Raman measurement results show that, silicomolybdic acid could form on the Mo surface in the slurry because of reaction between Moly oxide and silica particles, which causes the adsorption and inhibition of Mo etching and polishing. (C) 2017 The Electrochemical Society. All rights reserved.
Improved Removal Selectivity of Ruthenium and Copper by Glycine in Potassium Periodate (Kio4)-Based Slurry

Xu Zeng,Jing-Xuan Wang,Hai-Sheng Lu,Fei Chen,Xiao-Meng Zhang,Xin-Ping Qu

DOI: https://doi.org/10.1149/2.055211jes

IF: 3.9

2012-01-01

Journal of The Electrochemical Society

Abstract:Ruthenium and copper polishing in a potassium periodate (KIO4)-based slurry with glycine is studied. Glycine suppresses etching of Ru while it accelerates dissolution of Cu in the KIO4-based slurry at pH 9. Selective removal of the two metals can be achieved by changing the glycine content in the slurry at pH of 9. The effects of glycine on inhibiting oxidation of Ru and chelating oxidation of Cu are investigated by electrochemical measurements and X-Ray photoelectron spectroscopy. The mechanisms for the inhibitory effect of glycine on Ru removal in KIO4 based slurry are discussed. (C) 2012 The Electrochemical Society. [DOI: 10.1149/2.055211jes] All rights reserved.
Effects of Colloidal Silica on the CMP of Molybdenum in the Alkaline Slurry

Hui Feng,Li-Ao Cao,Ji-Yu Feng,Xin-Ping Qu

DOI: https://doi.org/10.1109/icpt.2014.7017248

2014-01-01

Abstract:The effects of colloidal silica on the CMP of Molybdenum (Mo) are investigated in different slurries with H2O2 as oxidizer. It is found that both RR (removal rate) and SER (static etching rate) decrease after adding colloidal silica into the alkaline slurry. The adsorption between the colloidal silica particles and Mo film is observed. Raman spectra show that silicomolybdic acid forms from reaction between colloidal silica and Mo oxide. The mechanism of colloidal silica's inhibition on Mo removal is discussed.
The effect of glycine and benzotriazole on corrosion and polishing properties of cobalt in acid slurry

HaiSheng Lü,Xu Zeng,Jingxuan Wang,Fei Chen,XinPing Qu

DOI: https://doi.org/10.1149/2.036209jes

IF: 3.9

2012-01-01

Journal of The Electrochemical Society

Abstract:Cobalt has caused much interest as an adhesion layer for copper metallization in the next generation interconnect technology. This work investigates the effects of glycine and BTA on corrosion and polishing properties of Co in the acid slurry. The potentiodynamic polarization measurement results show that glycine can increase the corrosion rate of Co. In the solution containing H2O2, adding glycine can make the Co surface smoother. In the slurry without H2O2, BTA shows good inhibition effect on Co corrosion. BTA can adsorb on the Co surface through physisorption and chemisorption, and obeys Langmuir absorption isotherm. In the acid slurry with H2O2, BTA will react with Co2+ ions and form insoluble networked nanoparticles ([Co(II)(BTA)(2)center dot H2O](n)) on the Co surface, and induce reduction of the removal rate and static etch rate of Co. (C) 2012 The Electrochemical Society. [DOI: 10.1149/2.036209jes] All rights reserved.
Electrodeposition of Molybdenum in the [BMP]Tf2N Ionic Liquid at Low Temperature

Yang Huiling,Ding Jingjing,Jiang Yidong,Ling Guoping

2018-01-01

Rare Metal Materials and Engineering

Abstract:Electrodeposition of molybdenum in the 1-butyl-1-methylpyrrolidinium bis (trifluoromethylsulfonyl) amide ([BMP]Tf2N) ionic liquid was investigated. MoCl5-[BMP]Tf2N was used as the electrolyte of electrodeposition and cyclic voltammetry curves were tested at various temperatures ranging from 25 degrees C to 120 degrees C. Electrodeposition was carried out using a potentiostatic method. Deposits were observed and characterized by SEM, EDS, TEM and XPS. The results show that the electrochemical reduction behavior of Mo changes significantly when the temperature above 100 degrees C in the temperature range of 25-120 degrees C. The metallic molybdenum can be obtained potentiostatically at 2.2 V and -2.7 V on platinum electrode at 120 degrees C. Deposit obtained at 2.2 V is flat without cracks, while deposit obtained at -2.7 V contains crystalline molybdenum with cracks in the deposited layer. The reduction product for Mo(V) is insoluble substance so that Mo(0) cannot be obtained at 60 degrees C. Mechanism of the electrochemical reduction of molybdenum in the [BMP]Tf2N was also discussed.
Effect of glycine on copper CMP

Soocheon Jang,Haedo Jeong,Minjong Yuh,Inho Park,Jaehong Park

DOI: https://doi.org/10.1007/s40684-016-0019-1

2016-04-01

Abstract:Chemical mechanical polishing (CMP) technology has been newly applied in printed circuit board (PCB) field for satisfying requirements from miniaturization of mobile devices. This paper focuses on the complexing agent to increase the removal rate for thick Cu layer. In order to find out optimum type and concentration of the complexing agent, experiments have been done in terms of electrochemical analysis, surface roughness and removal rate. As concentration of complexing agent (glycine) in slurry increased, it was confirmed that corrosion current density increased in potentio-dynamic curve since it promoted production of new Cu ion by decreasing amount of Cu ion of chemical reaction layer. Finally, it was possible to confirm that chemical reaction had a direct correlation with removal rate through CMP evaluation.

engineering, mechanical, manufacturing,green & sustainable science & technology
Electrodeposition of Molybdenum from Water-in-Acetate Electrolytes

Quanhong Liu,Qiang Huang

DOI: https://doi.org/10.1149/1945-7111/ad59c8

IF: 3.9

2024-06-20

Journal of The Electrochemical Society

Abstract:This paper reports a systematic study on the electrodeposition of metallic molybdenum from water-in-salt electrolytes containing superhigh concentrations of acetate. Cyclic voltammetry and DC deposition were carried out on rotating disk electrodes with various concentrations of CH3COOK and CH3COONH4 to determine the effects of NH4+ and K+ on Mo deposition. A comparison was performed between CH3COOLi, CH3COONa, and CH3COOK to study the effects of different alkali metal cations. A synergistic effect was observed between K+ and NH4+, where Mo deposition rate is enhanced in the presence of both cations. However, such synergistic effect was not observed between NH4+ and other alkali cations. In addition, the impact of substrate on Mo deposition was also studied using Pt and Cu electrodes with different activity toward hydrogen evolution reaction. Electron microscopy, X-ray diffraction, and X-ray photoelectron spectroscopy were used to characterize the surface morphology, crystallographic structure, and oxidation state of Mo in the electrodeposited films.

electrochemistry,materials science, coatings & films
The Effect of H2O2 and 2-MT on the Chemical Mechanical Polishing of Cobalt Adhesion Layer in Acid Slurry

Hai-Sheng Lu,Jing-Xuan Wang,Xu Zeng,Fei Chen,Xiao-Meng Zhang,Wen-Jun Zhang,Xin-Ping Quz

DOI: https://doi.org/10.1149/2.017204esl

2012-01-01

Electrochemical and Solid-State Letters

Abstract:Cobalt has emerged as a potential adhesion layer for advanced copper metallization. This work investigates the role of oxidant and inhibitor on the corrosion and polishing properties of cobalt in the acid slurry. It is found that H2O2 could greatly increase the static etch rate (SER) and removal rate (RR) of cobalt. The 2-Mercaptothiazoline (2-MT) is very efficient to inhibit cobalt corrosion and reduce the SER and RR of cobalt in the acid slurry. In the glycine based slurry at pH = 5, by using 2-MT, the corrosion potential difference between Co and Cu can be reduced to a very small value. (C) 2012 The Electrochemical Society. [DOI:10.1149/2.017204esl] All rights reserved.
Effect of Mo Addition on Corrosion Behavior of High-Entropy Alloys CoCrFeNiMox in Aqueous Environments

Xu-Liang Shang,Zhi-Jun Wang,Qing-Feng Wu,Jin-Cheng Wang,Jun-Jie Li,Jia-Kang Yu

DOI: https://doi.org/10.1007/s40195-018-0812-7

2018-09-05

Acta Metallurgica Sinica (English Letters)

Abstract:The corrosion behavior of CoCrFeNiMox alloys was investigated in aqueous environments, NaCl and H2SO4 solutions, respectively, to simulate typical neutral and acidic conditions. The cyclic polarization curves in NaCl and the potentiodynamic curves in H2SO4 clearly reveal the beneficial effects of Mo and the detrimental effect of σ-phase on the corrosion resistance. The X-ray photoelectron spectroscopy results of CoCrFeNiMox alloys in H2SO4 solution indicate that Cr and Mo predominate the corroded surface of the alloys, where Mo primarily exists in the form of MoO3.
The Role of Diethanolamine on Chemical Mechanical Polishing in Alkaline Glycine-Based Slurries for Cobalt Interconnects

Lifei Zhang,Tongqing Wang,Shunfan Xie,Xinchun Lu

DOI: https://doi.org/10.1149/2162-8777/acce05

IF: 2.2

2023-01-01

ECS Journal of Solid State Science and Technology

Abstract:Cobalt (Co) and its low resistivity, superior adhesion property, and void-free seamless fill ability, pledge to transform the landscape of integrated circuits in many areas, especially in interconnects and logic contacts. Chemical mechanical polishing (CMP), which can realize local and global planarization, has been recognized as one of the indispensable manufacturing approaches for the fabrication of multilevel metal interconnection structures. The present work introduces diethanolamine (DEA) into our alkaline glycine-based slurries for Co CMP process. The action mechanism of DEA on Co CMP process in glycine-based slurries at pH 8.1 has been clearly revealed by various approaches, including polishing and static etching experiments, X-ray photoelectron spectroscopy survey, electrochemical analysis, as well as adsorption isotherm calculation. At low concentrations, DEA could be able to accelerate the polishing process via its auxiliary complexing effect, obtaining higher removal rates and larger corrosion current densities. Some pitting corrosion could appear on Co surfaces due to the production of Co-glycine complex as well as the auxiliary complexing process, making rougher surface qualities. On the other hand, when the DEA concentration increased to a certain level, it could play a role of corrosion inhibitor, protecting Co surfaces by forming a stable passive layer and moderating material removal rates, removal selectivity, and surface roughness.
STUDY ON OXIDATION ALKALINE LEACHING BEHAVIOR OF MOLYBDENUM FROM Mo-BEARING BLACK SHALE

Li Xin-bing

Abstract:Oxidation and dissolution of Mo-bearing minerals are key factors to enhance the Mo leaching rate from Mo-bearing black shale.The paper analyzes the theory of oxidative alkaline leaching of Mo-bearing black shale and draws molybdenum concentration-pH figure,based on which,several experiment are completed.The experimental results show that the leaching rate of molybdenum under the different pH of the leaching system of Mo-bearing black shale was consistent with the lgT-pH diagram under the condition of temperature 150℃,reacting time 3 hours,agitator rotating 500 r/min and oxygen pressure of 1.2MPa.

Chemistry,Environmental Science
INHIBITIVE EFFECTS OF MOLYBDENATE ON IRON ARTIFACTS DURING DESALINATION PROCESS

HU Gang,LU Guo-cheng,XU Chun-chun,WU Xiao-hong

DOI: https://doi.org/10.3969/j.issn.1005-748x.2007.04.010

2007-01-01

Abstract:Potentiodynamic polarization and electrochemical impedance spectroscopy(EIS) methods were used to study the effects of molybdenate inhibitor on electrochemical behavior of simulated cast iron artifacts in alkaline desalination solution.The rust composition of the cast iron specimen after desalination was analyzed by X-ray photoelectron spectroscopy(XPS).The molybdenate inhibitor increased the reaction resistance and decreased the anodic current density.The specimen corrosion was restrained effectively during desalination process.The XPS results indicate that the molybdenate transformed the rust composition.A steady deposit film containing Fe2O3,FeMoO4 and MoO3 formed on the surface of the specimen.It increased the corrosion resistance of the rust layer.And the cast iron matrix was protected perfectly during desalination process.
Chemical Mechanical Polishing of Molybdenum in Potassium Iodate-Based Acidic Slurries

Peng He,Shuai Shao,Xin-Ping Qu

DOI: https://doi.org/10.1149/2.0061806jss

IF: 2.2

2018-01-01

ECS Journal of Solid State Science and Technology

Abstract:Chemical mechanical polishing (CMP) properties of molybdenum (Mo) by using potassium iodate (KIO3) as the oxidizer and colloidal silica as abrasives have been systematically investigated. It is revealed that the removal rate (RR) of Mo will increase as the concentration of KIO3 and colloidal silica abrasives increase. Both the static etching rate (SER) and the RR of Mo are much higher in the KIO3-based acidic solution than those in the alkaline solution. The lowest SER (around 2.2 nm/min) and the highest RR (around 90 nm/min) are achieved in the 0.1 M KIO3 solution at pH 2. Comprehensive measurements find that in the KIO3-based acidic solution, the passivation films on the Mo surface are basically MoO3 and Mo2O5 with excellent passivation properties, which are very soft with a small hardness value and can be easily removed through mechanical interaction, especially at pH 2. (C) 2018 The Electrochemical Society.
Study on synergetic effect of potassium pyrophosphate and benzotriazole on chemical mechanical planarization of GLSI low-technology node molybdenum barrier layer

Pengfei Wu,Baoguo Zhang,Yunhui Shi,Mengchen Xie,Ye Wang,Dexing Cui,Min Liu,Wenhao Xian

DOI: https://doi.org/10.1016/j.mssp.2023.107830

IF: 4.1

2023-09-21

Materials Science in Semiconductor Processing

Abstract:With the development of the sub-14 nm technology node of integrated circuit (IC), the resistivity of interconnection and barrier layer materials becomes a critical factor for the performance of IC devices. Molybdenum (Mo) with low resistivity and other excellent properties has recently become a promising material used as a barrier layer. However, it is difficult to control the galvanic corrosion and the removal rate selectivity between Cu and Mo. Here in, this paper focuses on the CMP of Mo-based Cu interconnection and aims at minimizing the galvanic corrosion between Cu and Mo. The results demonstrate that a corrosion potential difference as low as 3 mV can be achieved while the removal rate of Mo and Cu is 308 Å/min and 302 Å/min, respectively, with the addition of an optimum amount of potassium pyrophosphate (K 4 P 2 O 7 ) and benzotriazole (BTA). Furthermore, a new mechanism is proposed that BTA can more preferentially react with Mo than K 4 P 2 O 7, and it is adsorbed on Mo surface to inhibit corrosion. Briefly, the insoluble Mo oxide and the complexing product of Mo can inhibit the corrosion synergistically.

engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied
The effects of additive agents on zinc and zinc-nickel alloys electrodeposited on steel substrates in acidic electrolytes

C. PETIT,S. DILIBERTO,A. ANTOINE,C. BOULANGER

DOI: https://doi.org/10.1016/j.electacta.2024.143977

IF: 6.6

2024-02-22

Electrochimica Acta

Abstract:The influence of glycine, as a chelating agent, and triblock copolymer mixture of PPG-PEG-PPG and PEG1000, as a suppressor agent, on the deposition mechanisms of zinc and zinc-nickel alloys were studied by cyclic voltammetry (CV) and potentiometric electrochemical impedance spectroscopy (PEIS), using electrolyte solutions of chlorinated acid. Cyclic voltammetry measurements show that the composition of the electrolytic solution affects the voltammogram profiles. Complementary PEIS investigations allowed the electrodeposition mechanisms to be highlighted depending on the composition of the electrolytic solution. The electrodeposition of zinc, in the absence of additives, occurs in a single cathodic wave from the ZnCl 3 − species, whereas in the presence of glycine, a second more cathodic reduction wave is relative to the Zn(Gly) 2 2+ species. The presence of the PPG-PEG-PPG and PEG1000 triblock copolymer induces a clear inhibition of the zinc reduction. Nevertheless, the zinc electrodeposition follows a three-dimensional instantaneous nucleation. The zinc electroplating mechanism involves a capacitive semi-circle at high frequency and two inductive loops at medium and low frequencies assigned to two adsorbed intermediates onto the substrate whatever the electrolyte composition. The presence of the polymer mixture affects the zinc reduction by increasing the charge-transfer resistance and the adsorption phenomena on the substrate. The electrodeposition of zinc-nickel alloys reveals a single reduction wave, from ZnCl 3 − and Ni(Gly) 2+ species, and multiple anodic signals depending on the electrolytic composition, according to the presence of glycine to chelate the nickel species. The zinc-nickel electroplating was evidenced to be a multiple-step process with a three-dimensional instantaneous nucleation, including intermediate species adsorbed onto the substrate. The equivalent circuit proposed consists of two capacitive half-circles separated by an inductive loop for any electrolytic solution. However, the impedance spectra were affected by the presence of glycine by modifying the inductive loop reflecting the first adsorbed intermediate (Ni(I) ads ). The morphology of zinc and zinc-nickel, with a nickel content between 14 and 19 wt.%, is affected by the electrolyte composition, however with the same crystal lattice. The preferential orientation of the lattice was shown to depend on the additives present in the solution.

electrochemistry
Excellent Performance of Glycine in Isolating Mn during Hydrothermal Leaching of LiMn 2 O 4 Cathode Materials

Qingxin Zheng,Seiya Hirama,Akitoshi Nakajima,Tetsufumi Ogawa,Yuta Nakayasu,Zixian Li,Masaru Watanabe

DOI: https://doi.org/10.1021/acssuschemeng.3c02854

IF: 8.4

2023-08-23

ACS Sustainable Chemistry & Engineering

Abstract:In this study, hydrothermal leaching of spent LiCo x Ni y Mn1–x–y O2 (NMC) and commercial LiMn2O4 (LMO) cathode materials was conducted by applying glycine as a leaching agent. During the hydrothermal leaching of spent NMC, the effects of reaction temperature, reaction time, glycine concentration, and pulp density on the leaching efficiencies of Li, Co, Ni, and Mn were investigated. With the increase in reaction temperature and time, the leaching efficiencies of Co, Ni, and Mn significantly increased, but even at 200 °C for 15 min, the leaching efficiency of Mn was as low as 16%. The order of the reaction rate was confirmed to be Mn < Co < Ni < Li. Compared with Li, Co, and Ni, the leaching performance of Mn was much poorer, but this special property makes it possible for glycine to isolate Mn directly from the LMO cathode material. During the hydrothermal leaching of the commercial LMO cathode material with glycine, the leaching efficiency of Li significantly increased with reaction temperature and time and was much higher than that of Mn under the same condition. A kinetic study using a shrinking unreacted core model was conducted. The results revealed that the diffusion within the product layer was the rate-limiting step for leaching Li and Mn. Based on the determined reaction rates, the activation energy of Li leaching was calculated to be 57.1 kJ/mol within 0–15 min and 69.6 kJ/mol within 15–90 min, respectively, while that of Mn leaching was 86.7 kJ/mol. At 200 °C for 120 min, the leaching efficiencies of Li and Mn achieved 99.5 and 7.6%, respectively, which means that 92.4% of Mn was successfully isolated and kept in the solid residue. After calcinating at 600 °C for 1 h, the final product was obtained and identified to be Mn2O3 with a purity of 99.0%. This was the first report on the excellent performance of glycine in isolating Mn and achieving Mn isolation in a single-step hydrothermal leaching process of LMO cathode materials with such a high recovery and product purity.

chemistry, multidisciplinary,engineering, chemical,green & sustainable science & technology

Study of inhibition mechanism of glycine on the electrochemical behavior of Mo in the alkaline slurry

Inhibition Effect of Glycine on Molybdenum Corrosion During CMP in Alkaline H2O2 Based Abrasive Free Slurry

Effect of glycine on CMP process of molybdenum

Investigation on Inhibition of Ruthenium Corrosion by Glycine in Alkaline Sodium Hypochlorite Based Solution

Synergetic effect of H 2 O 2 and glycine on cobalt CMP in weakly alkaline slurry

Chemical Mechanical Polishing of Mo Using H2O2 as Oxidizer in Colloidal Silica Based Slurries

Improved Removal Selectivity of Ruthenium and Copper by Glycine in Potassium Periodate (Kio4)-Based Slurry

Effects of Colloidal Silica on the CMP of Molybdenum in the Alkaline Slurry

The effect of glycine and benzotriazole on corrosion and polishing properties of cobalt in acid slurry

Electrodeposition of Molybdenum in the [BMP]Tf2N Ionic Liquid at Low Temperature

Effect of glycine on copper CMP

Electrodeposition of Molybdenum from Water-in-Acetate Electrolytes

The Effect of H2O2 and 2-MT on the Chemical Mechanical Polishing of Cobalt Adhesion Layer in Acid Slurry

Effect of Mo Addition on Corrosion Behavior of High-Entropy Alloys CoCrFeNiMox in Aqueous Environments

The Role of Diethanolamine on Chemical Mechanical Polishing in Alkaline Glycine-Based Slurries for Cobalt Interconnects

STUDY ON OXIDATION ALKALINE LEACHING BEHAVIOR OF MOLYBDENUM FROM Mo-BEARING BLACK SHALE

INHIBITIVE EFFECTS OF MOLYBDENATE ON IRON ARTIFACTS DURING DESALINATION PROCESS

Chemical Mechanical Polishing of Molybdenum in Potassium Iodate-Based Acidic Slurries

Study on synergetic effect of potassium pyrophosphate and benzotriazole on chemical mechanical planarization of GLSI low-technology node molybdenum barrier layer

The effects of additive agents on zinc and zinc-nickel alloys electrodeposited on steel substrates in acidic electrolytes

Excellent Performance of Glycine in Isolating Mn during Hydrothermal Leaching of LiMn 2 O 4 Cathode Materials