Topographic Analysis Of Holes Drilled By Ultrahigh Intensity Nanosecond Uv Laser

Qh Wu,Yr Ma,L Yu,Xh Han,Gz Wang,Rc Fang,Xl Chen
2001-01-01
Abstract:The topography of the holes drilled by a state-of-the-art, ultrahigh intensity, 8ns width, 355nm and 266nm laser in Ni-based superalloy Inconel 718 were analyzed. The origin of droplets, micropores and microcracks on the surface of hole-walls were identified. Qualitative difference in the character of microcracks in different laser processing indicated that the continuous microcracks resulted from thermal effect for 355nm laser processing and the island chain-like microcracks resulted from photochemical effect for 266nm laser processing. In the ultrahigh intensity laser ablation, e.g. >200GW/Cm-2, the role of mechanical load on the surface was analyzed, and the role of grain boundaries for the origin of micropores on the hole-wall surface was discussed. The ripple patterns were found on the hole-wall and explained in light of the interference during laser hole drilling.
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