Abstract:The performance degradation and thermal-mechanical problems caused by the huge heat in integrated circuits, especially high power integrated circuits, such as RF circuits, are gradually attracting attention. Therefore, thermal simulation is particularly important in the circuit design process. However, the current integrated circuit design software and the finite element thermal simulation software are not related to each other, and the complexity of the circuit files can't be modeled in the thermal simulation software in detail. As a result, the simulation method only focus on the total power density and the main circuit substrate materials, but don't pay attention to the high thermal conductivity path from hot spot to heat sink composed of wiring, through silicon via (TSV) and Bump. The absence of this electro-thermal collaborative design will lead to great simulation errors, which will affect the design process and performance of the circuit. In order to simulate the structure which has a great effect on the heat dissipation of integrated circuits, this paper provides a conversion method from circuit file to three dimensional(3D) geometry structure. In this method, we can extract the detailed multilayer circuit structure from circuit files in popular circuit design software, and model the circuit structure in finite element simulation software, so as to achieve accurate simulation of high thermal conductivity structure of integrated circuits. To verify the conversion effect and simulation accuracy of the method, this paper takes an actual Low Temperature Co-fired Ceramic(LTCC) radio frequency(RF) circuit as an example to compare the thermal test and simulation results. The results show that thermal simulation based on circuit reconstruction is more accurate than rough simulation ignoring through holes and wiring layers, and the error is less than 4.84% compared with the actual thermal test.

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