A Minimal Boundary Thermal Analysis Method for Stacked 3D IC

YU Hui,WU Hao,Gengsheng Chen,TONG Jia-rong

DOI: https://doi.org/10.3969/j.issn.0372-2112.2012.05.001

2012-01-01

Abstract:Current thermal analysis tools can only efficiently handle 3D integrated circuits with simple structure.To deal with more complicated stacked 3D integrated circuits,more complex,and error-prone boundary conditions need to be set up.In this paper,we propose simple,yet efficient method,called minimal boundary method,to handle the complicated boundary conditions by transforming the 3D stacked structure to a structure with simple boundary(thus for easy boundary condition set up).To boost the thermal analysis via iterative conjugate gradient method,we construct a novel preconditioner,which consists of the thermal conductor matrices of the building blocks of the stacked 3D structure as its diagonal blocks.Experimental results show that by using finite element method along with the proposed minimal boundary pre-processing,we can obtain accurate thermal analysis results.The proposed preconditioner can reduce the 90% iterations in the conjugate gradient method.