Preparation method of nonvolatile resistance variation memory structure

Yuchao Yang,Fei Zeng,Feng Pan
2011-01-01
Abstract:The invention discloses a nonvolatile resistance variation memory structure and preparation method in the crossing field of new material and microelectronic technology. The structure comprises a silicon lining, as well as a silicon oxide dielectric layer, a titanium adhesion layer, a platinum substrate electrode layer, a first zinc oxide dielectric layer, a tungsten nano crystal electrical chargestorage layer, a second zinc oxide dielectric layer and a top electrode material layer, tungsten nano crystal is wrapped and buried in the zinc oxide dielectric layers to be used as electrical chargestorage layer, and the capture/release action of tungsten nano crystal towards electrons is used for realizing the shift between high resistance and low resistance. The structure of the invention leads to the improvement of the programming/erasing speed of a nonvolatile storage unit, the reduction of programming/erasing voltage, and the improvement of data reservation feature as well as programming/erasing toleration and other storage performances; the preparation method is simple and compatible with conventional CMOS silicon plane technique.
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