Exploring nanoscale metallic multilayer ta/cu films: Structure and some insights on deformation and strengthening mechanisms
Andrey Bondarev,Daniel Karpinski,Tomas Polcar
DOI: https://doi.org/10.2139/ssrn.4725562
IF: 4.537
2024-04-28
Materials Characterization
Abstract:Nanoscale metallic multilayer (NMM) films are systems offering insight into the role of interfaces in metal plasticity, deformation, and strengthening mechanisms. Magnetron sputtering was used to fabricate the Ta/Cu NMM films with a periodicity (equal Ta and Cu layer thickness) from 6 to 80 nm, with resulting structure exhibiting diffuse tetragonal β-Ta and face-centred cubic Cu phase. Transmission electron microscopy and X-ray diffraction analyses revealed that, irrespective of the period, all films manifested a polycrystalline structure. The growth direction of both Cu and Ta layers was found to be along 〈001〉 β-Ta || 〈111〉 Cu directions, with the crystallite size constrained by the layer thickness. The studies showed that the Ta/Cu NMMs exhibited compressive residual macro-stress and flow strength, and enhanced elastic recovery at the periodicity of ≤12 nm. Activation volume V ⁎ value of 11 to 20 b 3 as determined from the indentation creep test under a constant load, may indicate a mixed deformation mechanism. This mechanism likely involves the emission of dislocations from the incoherent Ta/Cu interfaces, as well as the formation of screw dislocations within Cu grains. The high-load indentation test, TEM studies, and the rCLS model collectively demonstrate that all NMM films predominantly undergo plastic deformation. This plastic deformation primarily occurs within the soft Cu layer, while the propagation of dislocations across the incoherent interface is largely excluded.
materials science, multidisciplinary,metallurgy & metallurgical engineering, characterization & testing