Thermal Contact Resistance: Impact of Nanoscale Roughness on Heat Transport across the Solid–Solid Interface (Adv. Mater. Interfaces 4/2020)

Jingwei Wang,Zhongwei Zhang,Run Shi,Bananakere Nanjegowda Chandrashekar,Nan Shen,Haisheng Song,Ning Wang,Jie Chen,Chun Cheng
DOI: https://doi.org/10.1002/ADMI.202070018
IF: 5.4
2020-01-01
Advanced Materials Interfaces
Abstract:In article number 1901582 by Jingwei Wang, Jie Chen, Chun Cheng and co-workers, a simple method is developed to quantitatively measure the thermal contact resistance (TCR) between 1D microwire and substrate under different interface roughness. With increasing nanoscale roughness, TCR increases significantly accompanied by a large disturbance in thermal transport. By inserting a monolayer graphene into the rough interface, both TCR and thermal transport disturbance reduce. This enhancement by graphene is more evident at interface with large nanoscale roughness.
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