Modeling and Measurement of A Novel Shielding Design in Silicon Interposer
Yong-Sheng Li,Er-Ping Li,Peng-Fei Qin,Xing-Chang Wei,Wen-Yan Yin
DOI: https://doi.org/10.1109/isemc.2016.7571644
2016-01-01
Abstract:Crosstalk between the interconnects cause serious electromagnetic interference (EMI). The high density interconnects, including redistribution layers (RDLs) and through-silicon-vias (TSVs) in silicon interposer, require effective crosstalk-reduction signaling schemes. In this paper, a novel co-planar waveguide (CPW) RDL structure, where the ground lines directly contact the silicon substrate without any insulation layer, is proposed for crosstalk mitigation. An equivalent circuit model is developed to capture the crosstalk reduction mechanism. Based on the model, the main requirements of its validity, i.e., good ohmic contact and high-conductivity silicon, are discussed in details. Finally, a test sample, which meets the two requirements, is fabricated and measured. The shielding effect is achieved successfully and the measurement results show a good correlation with the results produced by the developed equivalent circuit.