Finite Element Analysis of the Thermal Stress of the Ceramic Composite Piping Prepared by Centrifugal-SHS

WANG Yu-fei,YANG Zhen-guo,GUO Bao-shan
DOI: https://doi.org/10.3969/j.issn.1001-4381.2005.02.002
2005-01-01
Abstract:The temperature distribution and variation in the cooling course of the ceramic composite piping prepared by centrifugal-SHS were modeled and analyzed so as to provide the basis of the choice of process parameter and interface structure analysis of the piping. With the function of transient thermal analysis and thermal-structure coupling of ANSYS, the residual thermal stress of the composite piping was numerically simulated and the influence on the performance of the piping with thickness of the SHS layer was studied as well. The results of numerical analysis indicate that modulating the thickness of the SHS layer can reduce the residual thermal stress on the interface, and consequently, the safety reliability of the ceramic composite piping can be enhanced.
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