Finite Element Analysis of Stress Field of Thermal Barrier Coating during the Deposition Process

YANG Xue-song,ZHOU Meng,ZHANG Yu,MAO Wei-guo
DOI: https://doi.org/10.3969/j.issn.1000-5900.2012.04.006
2012-01-01
Abstract:Residual stress distributions of thermal barrier coating system with three-layers were analyzed by finite element method during the deposition process.Effects of deposition temperature and ceramic coating thickness on stress distribution were discussed.The thicker the ceramic coating thickness and the higher the temperature are,the larger the heterogeneous regions of the stress distribution near the both edges of ceramic coating and in substrate are.The calculation results indicate that the stress of ceramic coating and bond coat are compressive with the change of deposition temperature and ceramic coating thickness,whose values range from-50~-300 MPa and-30~-140 MPa,respectively.While stress in the substrate is tensile and it changes from 5 to 55 MPa.It is found that shear residual stress characteristic at the ceramic coating and bond coat interface show a hyperbolic sine distribution.The shear residual stress at the center of the interface is zero.The results in our paper would be helpful to predicting residual stress distribution of thermal barrier coating with irregular geometry,which can provide an important basis of stress analysis for evaluating mechanical properties of thermal barrier coating system during tensile tests in the future.
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