Effect of Si additions on intermetallic compound layer at aluminum/steel interface bonded by rolling

Dejing Zhou,Zhi Chen,Xinming Zhang,Jianguo Tang
DOI: https://doi.org/10.13251/j.issn.0254-6051.2014.01.005
2014-01-01
Abstract:The Al-Si alloy/low-carbon steel clad plates bonded by cold-rolling were annealed at different temperatures and time .Silicon's effect on the formation of the intermetallic compound (IMC) in the interface was investigated by use of optical microscope (OM), scanning electron microscope (SEM) and EDAX energy dispersive spectrometer .The results show that the clad plates with 0.67wt% of Si additions have the best effect for preventing the growth of the IMC layer , which has the highest IMC critical forming temperature of 615 ℃.But when Si additions is more than 1.62wt%, it decreases the melting point of Al-Si alloy, increases the element diffusion rate in Al-Si alloy, accelerate the IMC growth , and the structures of IMC are τ6-Al8 Fe2 Si+τ5-Al4.5 FeSi+η-Al5 Fe2 .
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