Interface evolution and strengthening of two-step roll bonded cu/Al clad composites
Wen-jing Wang,Hao Wang,Xue-feng Liu,Zhi-cheng Liu
DOI: https://doi.org/10.1016/j.matchar.2023.112778
IF: 4.537
2023-03-07
Materials Characterization
Abstract:The laminated metal composite plate has drawn great focus in view of its advantages of high performance. In this study, a two-step roll bonded Cu/Al clad composites was developed. The micromorphology, components, mechanical properties, and interfacial bonding strength of the Cu/Al clad composites were characterized by scanning electron microscope (SEM), electron back scattered diffraction (EBSD), transmission electron microscope (TEM), energy dispersive spectrometer (EDS), and universal materials testing machine, respectively. The results indicate that the interfacial bonding strength firstly increases and then decreases with the increase of the intermetallic compounds (IMCs) thickness, which can reach to 90 MPa with the process of cold rolling 40% reduction → pre-heating at 400 °C for 20 min → hot rolling 60% reduction. Further, the growth of the interfacial IMCs of Cu 9 Al 4 , CuAl 2 and CuAl is related to the pre-heating strategy and cold deformation. Thus, the kinetic equation is established. Moreover, the interfacial bonding mechanism is that the interfacial IMCs are fractured during the hot-rolling composite process and formed multiple 'microscopic extrusion dies' (MEDs) at the interface. Then, the fresh copper and aluminum are extruded from the MEDs (fractured IMCs) under the strong pressure by the hot rollers, and a solid welding interface between fresh copper and aluminum is achieved. Finally, the substrate metals and the intermetallic compound is formed into a serrated-like interface.
materials science, multidisciplinary,metallurgy & metallurgical engineering, characterization & testing