Progress in wafer bonding technology towards MEMS, high-power electronics, optoelectronics, and optofluidics
Jikai Xu,Yu Du,Yanhong Tian,Chenxi Wang
DOI: https://doi.org/10.1080/15599612.2020.1857890
2020-01-01
International Journal of Optomechatronics
Abstract:<span>Wafer bonding is an attractive technology that can join homo/heterogeneous materials into one composite. It has a wide range of applications in the micro-electro-mechanical system (MEMS), integrated circuit, consumer and power electronics, micro/nanofluidics, etc. Since all devices on the same wafer are sealed and tested at wafer size, it brings lots of benefits compared with the component-level packaging, such as substantial savings in time, materials, and labor. In this review, we firstly introduce the low- and room-temperature Si bonding and their applications in MEMS fabrication. Subsequently, we present applications of the third-generation semiconductor bonding towards optoelectronics. Due to the research in the electro-optical modulation of lithium niobate (LiNbO<sub>3</sub>) has made revolutionary progress in recent years, we also show the bonding method towards single-crystal LiNbO<sub>3</sub> thin-film fabrication. Finally, we set our sights on the bonding of infrared materials, which might be the next research hotspot for the emerging ultrasensitive sensors.</span>
engineering, mechanical, electrical & electronic,optics