Preparation and properties of a new organosilicon based curing agent for epoxy resins

Wei MA,Fei-long HAN,Jue CHENG,Jun-ying ZHANG

DOI: https://doi.org/10.3969/j.issn.1001-5922.2017.06.002

2017-01-01

Abstract:The curing agent for epoxy resins was synthesized by the hydrolysis and condensation reactions of aminopropyltriethoxysilane (KH550) to obtain a structure with Si-O-Si as the main segments and -NH2 as the reactive groups. The -NH2 groups of the curing agent reacted with the epoxy groups of epoxy resins to introduce the thermal stable Si-O-Si chain into the cross-linked network. The hydrolysis and condensation reactions were proved by comparing the 1FTIR and H NMR spectra of raw materials and reaction products, and the curing characteristic temperatures of reaction system were determined by non-isothermal DSC analysis and T~β extrapolation method. The maximum shear strength for bonding the bross substrate with E51 epoxy resin based mixture system was 14.4 MPa; the temperature at 10% weight loss of cured epoxy resin was 378.6 ℃ in N2 atmosphere. When the content of curing agent was 20 parts, the residual amount was 26.2%.