Silicon Hybridization for the Preparation of Room-Temperature Curing and High-Temperature-Resistant Epoxy Resin

Liping Rong,Jiaqi Su,Zhiguo Li,Xiaohui Liu,Dayong Zhang,Jinhua Zhu,Xin Li,Ying Zhao,Changhong Mi,Xianzhi Kong,Gang Wang
DOI: https://doi.org/10.3390/polym16050634
IF: 5
2024-02-28
Polymers
Abstract:Specialized epoxy resin, capable of achieving room-temperature profound curing and sustaining prolonged exposure to high-temperature environments, stands as a pivotal material in modern high-end manufacturing sectors including aerospace, marine equipment fabrication, machinery production, and the electronics industry. Herein, a silicon-hybridized epoxy resin, amenable to room-temperature curing and designed for high-temperature applications, was synthesized using a sol–gel methodology with silicate esters and silane coupling agents serving as silicon sources. Resin characterization indicates a uniform distribution of silicon elements in the obtained silicon hybrid epoxy resin. In comparison to the non-hybridized epoxy resin, notable improvements are observed in room-temperature curing performance, heat resistance, and mechanical strength.
polymer science
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